New foundry-sponsored sROMet TITAN available at TSMC 55 nm HV
Grenoble, France – May 26, 2014 -- Dolphin Integration provide users of 55 nm HV process with a new ROM architecture called TITAN.
Thanks to this new architecture, Dolphin Integration users can:
- reduce their die cost thanks to key patent for high density with a single metal programming layer, earning its qualifier of sROMet
- extend their battery life thanks to a minimal leakage in memory periphery
- facilitate integration with a large number of MUX options and high flexibility for address range
The ROM TITAN partakes in the TSMC sponsored offering at 55 nm HV, with the celebrated Single Port RAM RHEA and the Two Port Register File ERIS.
For more information about the sROMet TITAN TSMC 55 nm HV click here
Or contact Dolphin Integration Library Marketing Manager at libraries@dolphin-ip.com
About Dolphin Integration
Dolphin Integration contribute to "enabling mixed signal Systems-on-Chip". Their focus is to supply worldwide customers with fault-free, high-yield and reliable kits of CMOS Virtual Components of Silicon IP, based on innovative libraries of standard cells, flexible registers and low-power memories. They provide high-resolution converters for audio and measurement, regulators for efficient power supply networks, application optimized micro-controllers.
They put emphasis on resilience to noise and drastic reductions of power-consumption at system level, thanks to their own EDA solutions missing on the market for Application Hardware Modeling as well as early Power and Noise assessment. In addition strong experiences in ASIC/SoC design and fabrication, plus privileged foundry portal even for small or medium volumes, make them a genuine one-stop shop covering all customers’ needs for specific requests.
For more information, visit www.dolphin-integration.com
|
Dolphin Design Hot IP
Related News
- Dolphin Integration announce the availability of new ROM TITAN and ultra low leakage standard cell library SESAME BIV at TSMC 55 nm LP eFlash
- Dolphin Integration augments the TSMC IP Ecosystem at 40 nm ULP eFlash with new TITAN Read Only Memory
- Dolphin Integration sets up a large range of sponsored IPs at 55 nm to reduce SoC power consumption by up to 70%
- Ultra-low power memory generators silicon proven at TSMC 55 nm uLP and uLP eFlash
- LoPan, the complete platter at 55 nm uLP beyond sponsored libraries from Dolphin Integration
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |