2.5D GPU / 2D & 3D Vector Graphics (OpenVG) Accelerator - D/AVE HD
Rambus Signs Comprehensive License Agreement with Qualcomm
Agreement enables broad adoption of Rambus technologies for inclusion in Qualcomm chipsets
SUNNYVALE, Calif. – June 11, 2014 – Rambus Inc. (NASDAQ:RMBS) today announced that it has signed a comprehensive patent license agreement with Qualcomm Global Trading Pte. Ltd., a subsidiary of Qualcomm Incorporated. The agreement provides Qualcomm Incorporated and its subsidiaries with access to innovative patented memory, interface, and security technologies from Rambus. Other terms of the agreement are confidential.
“This agreement highlights our ongoing commitment to providing access to valuable memory and security technologies to industry leaders,” said Dr. Ron Black, president and chief executive officer at Rambus. “Engaging with Qualcomm with this agreement gives us an opportunity to collaborate with the broader industry to bring compelling solutions to the segment.”
In addition to certain high-performance, low-power memory innovations, this agreement provides Qualcomm Incorporated and its subsidiaries with access to patented security technologies developed by the Cryptography Research (CRI) division of Rambus. These security technologies include countermeasures for protecting integrated circuit systems on a chip (SoCs) against differential power analysis and other side channel attacks.
Rambus continues to innovate across memory architectures and security to meet the emerging requirements of device-driven segments like mobile and cloud. Working with industry leaders like Qualcomm positions Rambus’ inventions for broad adoption.
About Rambus
Rambus brings invention to market. Our customizable IP cores, architecture licenses, tools, services, and training improve the competitive advantage of our customer’s products while accelerating their time-to-market. Rambus products and innovations capture, secure and move data. For more information, visit rambus.com.
|
Related News
- Rambus Signs Comprehensive Agreement with STMicroelectronics
- Rambus and SK hynix Extend Comprehensive License Agreement
- Rambus Signs License Agreement for Its DPA Countermeasures to Beijing Tongfang Microelectronics Co., Ltd.
- Rambus Signs License Agreement with Gemalto to Protect Against Side-Channel Attacks
- Rambus Signs License Agreement with Western Digital
Breaking News
- JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
- BrainChip Gives the Edge to Search and Rescue Operations
- ASML targeted in latest round of US tariffs
- Andes Technology Celebrates 20 Years with New Logo and Headquarters Expansion
- Creonic Unveils Bold Rebrand to Drive Innovation in Communication Technologies
Most Popular
- Cadence to Acquire Arm Artisan Foundation IP Business
- AMD Achieves First TSMC N2 Product Silicon Milestone
- Why Do Hyperscalers Design Their Own CPUs?
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- New TSN-MACsec IP core for secure data transmission in 5G/6G communication networks
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |