IBM Preps for Post-Silicon Era
Rick Merritt, EETimes
7/14/2014 07:05 PM EDT
SAN JOSE, Calif. – A post-silicon era is coming quickly, a veteran semiconductor executive at IBM said after his company announced it will spend as much as $3 billion in the next five years on R&D programs to drive to and beyond the limits of silicon.
The spending does not represent an increase or any specific new programs at IBM Research. Rather, it is a statement of IBM's commitment to core hardware technology amid reports that the company is looking to sell its two chip fabs.
Analysts and insiders have said IBM may sell its East Fishkill, N.Y., and Burlington, Vt., fabs this year, most likely to Globalfoundries, but retain its research efforts. IBM is not commenting on the reports, but it did summarize its extensive research efforts across a broad array of chip-related programs.
E-mail This Article | Printer-Friendly Page |
Related News
- Google Preps for IBM, ARM Shift
- IBM leaves semiconductors - end of an era
- New IBM SyNAPSE Chip Could Open Era of Vast Neural Networks
- Mentor Graphics Accelerates SoC and Embedded System Delivery with a Native Embedded Software Environment for Pre- and Post-Silicon Development, Embedding QEMU, SystemC and Emulation
- Infineon Relies On DAFCA for Post-Silicon Validation
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards