Energy-efficient and programmable heterogeneous many-core platform with self-adaptive capabilities
Neuchâtel -- August 12, 2014 - The FlexTiles project was launched in 2011 by a consortium of industries, universities and RTOs coordinated by Thales. They have joined forces to develop a programmable heterogeneous many-core platform which can be reconfigured on the fly to meet advanced processing needs such as surveillance drones or driverless cars. With the project nearing its end (October 2014), a workshop is organized on September 1 in Munich to present results and offer a hands-on experience.
A major challenge in computing is to leverage multi-core technology to develop energy-efficient high performance systems. This is critical for embedded systems with a very limited energy budget as well as for supercomputers in terms of sustainability. The efficient programming of multi-core architectures remains an unresolved issue and will be an ever greater challenge as we move towards many-core solutions with more than a thousand processor cores predicted by 2020. The FlexTiles project defines and develops an energy-efficient yet programmable heterogeneous many-core platform with self-adaptive capabilities.
The many-core platform is associated with an innovative virtualization layer and a dedicated tool-flow to improve programming efficiency, reduce the impact on time to market and reduce the development cost by 20 to 50%. FlexTiles raises the accessibility of the many-core technology to industry - from SMEs to large companies - thanks to its programming efficiency and its ability to adapt to the targeted application using embedded reconfigurable technologies.
FlexTiles is a 3D stacked chip with a many-core layer and a reconfigurable layer. This heterogeneity brings a high level of flexibility in adapting the architecture to the targeted application domain for performance and energy efficiency.
A virtualization layer on top of a kernel hides the heterogeneity and the complexity of the many-core platform from its programmer and fine-tunes the mapping of an application at runtime. The virtualization layer provides self-adaptation capabilities by dynamic relocation of application tasks to software on the many-core layer (made up of general purpose and DSP processors) or to hardware on the reconfigurable layer. This self-adaptation is used to optimize load balancing, power consumption, hot spots and resilience to faulty modules.
A FlexTiles workshop will be held on September 1 within the International Conference on Field Programmable Logic and Applications, FPL2014, in Munich, Germany. Registration for the workshop is separate from the conference. More information about the workshop.
The FlexTiles FP7, www.flextiles.eu, project is co-funded by the European Commission under the Seventh Framework Program.
|
CSEM Hot IP
Related News
- ARM Announces New High-Performance System IP to Address Demand for Energy-Efficient "Many-core" Solutions for the Enterprise Market
- ShortLink AB and Dolphin Design partner to create a highly energy-efficient Sub-GHz ASIC design platform
- IMEC unveils tools to speed design of energy-efficient multi-processor SoC platforms
- BBright Expands Ultra HD Capabilities with intoPIX JPEG XS Technology in its V2.2 Decoder Platform
- Efficient and GlobalFoundries Partner to Enable a New Category of Ultra Energy-Efficient, High-Performance Processors
Breaking News
- Baya Systems Raises $36M+ to Propel AI and Chiplet Innovation
- Andes Technology D45-SE Processor Achieves ISO 26262 ASIL-D Certification for Functional Safety
- VeriSilicon and Innobase collaboratively launched second-generation Yunbao series 5G RedCap/4G LTE dual-mode modem IP
- ARM boost in $100bn Stargate data centre project
- MediaTek Adopts AI-Driven Cadence Virtuoso Studio and Spectre Simulation on NVIDIA Accelerated Computing Platform for 2nm Designs
Most Popular
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- Arm Chiplet System Architecture Makes New Strides in Accelerating the Evolution of Silicon
- InPsytech Announces Finalization of UCIe IP Design, Driving Breakthroughs in High-Speed Transmission Technology
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
E-mail This Article | Printer-Friendly Page |