3DSP Licenses its SP-5 core to Sony for next-generation advanced semiconductors
IRVINE, Calif., July 8, 2002 -- 3DSP Corporation, the leader in configurable digital signal processor (DSP) architectures, today announced that Sony Corporation has licensed its SP-5™ DSP core and DSP-Shuttle™ Intelligent Bus Controller for its next-generation semiconductor products. The Sony Corporation Semiconductor Network Company has agreed to a division-wide, multiple-use license of the core and controller that will be designed initially into semiconductor devices for audio applications.
"We are thrilled to enter into a relationship with Sony, who continues to be a great innovator, and we look forward to facilitating their next-generation products," said Kan Lu, CTO at 3DSP. "After going through a rigorous evaluation of our technology, this agreement represents a major endorsement of the proven usability of our DSP architectures while further validating our support infrastructure."
"In this highly competitive marketplace where performance, power and price are significant factors in gaining a new customer, we are very pleased with the recognition from Sony," claimed Didier Boivin, president and CEO of 3DSP. "This appears to be a very smart relationship," said Will Strauss, president of research firm Forward Concepts. "In light of the slow turn-around of the telecommunications industry, addressing the healthy consumer electronics market with an innovative audio product makes good sense. This new relationship also confirms the continued viability of the IP business model for DSP cores."
About 3DSP
3DSP offers the industry's only fully configurable digital signal processing architecture with a comprehensive object-oriented design environment and application-based intellectual property. 3DSP's technology empowers system designers to create custom SoC solutions in silicon that achieve significant competitive advantages in terms of performance, integration, power consumption, cost and time-to-market for tomorrow's multimedia, wireless and Voice over Packet applications. For more information on the company and its products, visit www.3dsp.com or contact 3DSP headquarters at 16271 Laguna Canyon Rd., Irvine, CA 92618, phone: (949) 435-0600 fax: (949) 435-0700.
SP-5, DSP-Shuttle, 3DSP Corporation and 3DSP are trademarks of 3DSP Corporation.
|
Related News
- Tenstorrent Licenses Baya Systems' Fabric into next-generation AI and Compute Chiplet Solutions
- Synopsys and Arm Strengthen Collaboration for Faster Bring-Up of Next-Generation Mobile SoC Designs on the Most Advanced Nodes
- Arteris Selected by BOS Semiconductors for Next-Generation Automotive Chips
- Arteris Unveils Next-Generation FlexNoC 5 Physically Aware Network-on-Chip IP
- Cadence Announces Broad Next-Generation Memory Standard Support in Samsung Foundry's Advanced Process Technologies
Breaking News
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
- RaiderChip Hardware NPU adds Falcon-3 LLM to its supported AI models
Most Popular
E-mail This Article | Printer-Friendly Page |