7 µW always on Audio feature extraction with filter banks on TSMC 22nm uLL
Microsemi Ships 22nm FinFET ASICs
Peter Clarke (Electronics360)
19 September 2014
Defense and communications chip supplier Microsemi Corp. (Aliso Viejo, Calif.) has started delivering ASICs to customers made using Intel's 22nm FinFET manufacturing process but is unlikely to ship FPGAs based on the process, according to Russ Garcia, executive vice president of marketing for the company.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Microsemi Hot IP
Related News
- Intel Custom Foundry Certifies Synopsys Design Platform for Intel's 22nm FinFET Low Power Process Technology
- Xilinx Ships 16nm Virtex UltraScale+ Devices; Industry's First High-End FinFET FPGAs
- Open-Silicon Ships 100 Million ASICs
- CEA-Leti Demonstrates Embedded FeRAM Platform Compatible with 22nm FD-SOI Node
- Bluetooth® V6.0 Channel Sounding RF Transceiver IP Core in 22nm & 40nm for ultra-low power distance aware Bluetooth connected devices
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset