Why UMC is Boosting Automotive Chip Business
Peter Brown, Electronics 360
19 September 2014
United Microelectronics Inc. (UMC) is making a strong push to increase its automotive semiconductor participation in order to take advantage of a changing marketplace shifting to one of the largest growing chip markets.
In terms of growth rate, automotive chips are right behind digital electronics (smartphones, Internet of Things (IoT)) as one of the fastest growing market among semiconductors, according to IHS Technology, which owns Electronics 360. The compound annual growth rate (CAGR) for automotive ICs is 5.1 percent during the next five years with some segments such as infotainment and advanced driver assistance systems (ADAS) expected to growth at 18 percent and 16 percent, respectively, IHS forecasts.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Related News
- Infineon and UMC Extend Automotive Partnership with Long-Term Agreement for 40nm eNVM Microcontroller Production
- SiMa.ai Welcomes Industry Leader Harald Kroeger to Scale its Business in the Automotive Market
- Siemens collaborates with UMC on design kits for automotive and power applications
- Cadence and UMC Collaborate on 22ULP/ULL Reference Flow Certification for Advanced Consumer, 5G and Automotive Designs
- Skyworks to Acquire the Infrastructure & Automotive Business of Silicon Labs
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset