Cadence Unveils Broad IP Portfolio for New TSMC 16nm FinFET Plus Process
SAN JOSE, Calif. -- 26 Sep 2014 -- Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced a broad portfolio of intellectual property (IP) for TSMC’s 16nm FinFET Plus (16FF+) process. The wide array of IP for the 16FF+ process enables systems and semiconductor companies to take advantage of the 15 percent speed improvement with same total power or 30 percent total power reduction at the same speed compared to the16FF process.
Currently under development for the 16 FF+ process, the Cadence IP portfolio includes multiple high-speed protocols for several key memory, storage and interconnect standards critical in the development of advanced SoC designs. Silicon-tested IP is expected to be available beginning in Q4 2014. For detailed protocol information and availability details, customers should contact their local Cadence salesperson.
Cadence also announced today the qualification of its digital implementation, signoff and custom/analog design tools for the 16nm FinFET Plus process. Click here for more information.
“Our new 16nm FinFET Plus process is an important development for next-generation SoC designs as they balance the task of increasing performance while reducing power and area,” said Suk Lee, senior director of the Design Infrastructure Marketing Division at TSMC. “As a long time trusted TSMC partner, we believe Cadence will play a vital role in the broad adoption of this new process with its certified tools and IP portfolio.”
“Our broad portfolio of IP for 16 FinFET Plus will enable design teams to ramp quickly on next-generation SoC designs and immediately realize the performance and power benefits of this new FinFET process,” stated Martin Lund, senior vice president and general manager of the IP Group at Cadence.
About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today’s integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available here.
|
Cadence Hot IP
Related News
- Cadence Announces DDR4 and LPDDR4 IP Achieve 3200 Mbps on TSMC 16nm FinFET Plus Process
- Cadence Announces Broad IP Portfolio for TSMC 10nm FinFET Process
- Synopsys Achieves Certification from Multiple Standards Organizations for Portfolio of IP on TSMC 16-nm FinFET Plus Process
- TSMC Certifies Cadence Innovus Implementation System on 16-nanometer FinFET Plus Process
- Cadence USB 3.0 Host Solution on TSMC 16nm FinFET Plus Process Achieves Industry Certification
Breaking News
- EXTOLL collaborates with BeammWave and GlobalFoundries as a Key SerDes IP Partner for Lowest Power High-Speed ASIC
- Celestial AI Announces Appointment of Semiconductor Industry Icon Lip-Bu Tan to Board of Directors
- intoPIX and EvertzAV Strengthen IPMX AV-over-IP Interoperability with Groundbreaking JPEG XS TDC Compression Capabilities at ISE 2025
- TeraSignal Demonstrates Interoperability with Synopsys 112G Ethernet PHY IP for High-Speed Linear Optics Connectivity
- Quadric Opens Subsidiary in Japan with Industry Veteran Jan Goodsell as President
Most Popular
- Certus releases radiation-hardened I/O Library in GlobalFoundries 12nm LP/LP+
- 创飞芯宣布其反熔丝一次性可编程(OTP)技术在90nm BCD 工艺上实现量产
- Alphawave Semi to Showcase Innovations and Lead Expert Panels on 224G, 128G PCIe 7.0, 32G UCIe, HBM 4, and Advanced Packaging Techniques at DesignCon 2025
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Mixel Announces the Opening of New Branch in Da Nang, Vietnam
E-mail This Article | Printer-Friendly Page |