The World's First G.fast Chipsets Announced by Sckipio
Ushers in New Era of Affordable Gigabit Ultra Broadband for the Masses
Taipei, Taiwan, October 8, 2014 – Sckipio Technologies today introduced the world’s first G.fast modem chipsets, fundamentally changing how telecom service providers can deliver 1Gbps ultra-broadband Internet access to bandwidth-hungry customers at the lowest cost per megabit.
Announced at Broadband Taiwan and presented at the Institute for Information Industry (III) Generation G Broadband seminar, Sckipio’s new DP3000 G.fast DPU Chipset and CP1000 G.fast CPE Chipset deliver 1Gbps-last-mile-broadband access over existing copper wiring. The new chipsets are based on the ITU ultra-broadband standard, G.fast (Recommendation G.9700/G.9701).
G.fast makes ultra-broadband affordable and accessible nearly everywhere, even in multiple-dwelling units (MDUs). G.fast distribution point units (DPU) get deployed within 250 meters of the home and can support up to 16 residences per DPU. These boxes receive fiber optic input and enable that traffic to run at 1Gbps over the existing copper wiring from the distribution point box to each consumer’s residence. In-home G.fast modems are consumer-installable and leverage existing copper wiring so expensive professional in-home installations are unnecessary. As a result, drilling into walls, digging up yards and dealing with time-consuming in-home installations are all eliminated.
The Sckipio’s G.fast chipsets are designed from scratch to be optimized for the high- performance requirements of G.fast; they are not a re-spin of previous VDSL solutions. The DP3000 G.fast DPU Chipsets simultaneously supports four 1 Gbps G.fast ports, up to 10Gbps of aggregated backhaul and full built-in vectoring support for as many as 64 subscribers.
“Sckipio is delivering on the full promise of G.fast,” said David Baum, Co-founder and CEO of Sckipio. “With Sckipio’s new G.fast chipsets, service providers won’t have to wait to get real G.fast with all the features and benefits that G.fast has to offer.” Before today’s announcement, prevailing expectations in the telecommunications market had previously set G.fast’s arrival to occur in late 2016.
Robin Mersh, CEO of the Broadband Forum, the leading consortium of broadband service providers and vendors globally, said, “G.fast is a very important part of the next generation for last-mile broadband access, which is based around our Fiber to the Distribution point (FTTdp) architecture. Many of our members are excited to test and deploy G.fast-based solutions as soon as possible.”
In parallel with today’s announcement, Sckipio also introduced two reference designs supporting its new chipsets: DP3016-EVM – a 16-port G.fast DPU reference design for use in FTTdp architectures and CP1000-EVM – a CPE bridge design for integration into residential gateways or for creation of stand-alone bridges.
Today, Sckipio also announced nine G.fast devices that will use Sckipio G.fast modems including four DPU devices, a residential gateway and four CPE bridges. Suttle, XAVi and Zinwell will all supply both DPU devices and CPE devices. VTech will supply a DPU, a residential gateway and a bridge device.
Building on the Sckipio standard compliant G.fast solution, Lantiq is the first company to introduce a residential gateway reference design built around G.fast, bringing gigabit speeds into the home. Read more on the Lantiq solution at www.lantiq.com/Gfast
Sckipio has been working with many OEMs, ODMs, and service providers to facilitate the pent-up demand for G.fast, and is already shipping engineering samples of the chipsets.
|
Related News
- Sckipio Licenses and Deploys CEVA-XC Communications DSP in World's First G.fast Chipsets
- Arteris Helps Sckipio Deliver the World's First G.fast Modems
- Sckipio G.fast Technology Zooms Ahead with Arteris FlexNoC IP for Ultra-Fast Broadband
- Sckipio Technologies Completes $10M Investment Round to Create G.fast Modem Chips
- Introducing T2M's Key IP Cores Empowering AI Chipsets and unleashing the true AI Potential
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |