5V Library for Generic I/O and ESD Applications TSMC 12NM FFC/FFC+
DMP GPU IP core Adopted for Nintendo's portable game console "New Nintendo 3DS"
Tokyo, Japan - October 14, 2014 - Digital Media Professionals Inc. (DMP), a leading provider of 3D/2D graphics and computing intellectual property (IP) cores, today announced that its 3D graphics IP core based on “DMP MAESTRO technology” has been adopted for “New Nintendo 3DS”, a portable game console product that Nintendo Co., Ltd. has released on Oct 11 in Japan.
Up to now, DMP has provided Nintendo with 3D graphics IP core for use with the Nintendo 3DS and Nintendo 2DS. In addition, its 3D graphics IP core is used in “New Nintendo 3DS” to render its game contents.
DMP is committed to continuing to contribute improving a user experience by its providing graphic technologies.
About DMP
Digital Media Professionals Inc. (TOKYO: 3652) develops industry leading 2D and 3D graphics solutions for global consumer electronics, mobile, embedded and automotive markets. The company was founded in Tokyo, Japan in 2002 and is currently developing several graphics IP cores based on the Khronos™ Group open standards and DMP’s cutting edge 3D graphics IP “Maestro Technology”.
|
DMP Inc. Hot IP
Related News
- DMP licenses GPU IP core "SMAPH-F" for Renesas Electronics' SoCs for Office Appliances
- Actions Technology's smart watch SoC adopted VeriSilicon's 2.5D GPU IP
- Canaan's RISC-V based edge AIoT SoC adopted VeriSilicon's ISP and GPU IPs
- DMP adopted for NEDO project of "Survey of issues for finding ideas regarding Technology Development for AI Chip and Next-generation Computing for High-efficiency and High-speed Processing"
- DMP Launches the world's smallest GPU IP core for Wearables and Internet of Things (IoT)
Breaking News
- JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
- BrainChip Gives the Edge to Search and Rescue Operations
- ASML targeted in latest round of US tariffs
- Andes Technology Celebrates 20 Years with New Logo and Headquarters Expansion
- Creonic Unveils Bold Rebrand to Drive Innovation in Communication Technologies
Most Popular
- Cadence to Acquire Arm Artisan Foundation IP Business
- AMD Achieves First TSMC N2 Product Silicon Milestone
- Why Do Hyperscalers Design Their Own CPUs?
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- New TSN-MACsec IP core for secure data transmission in 5G/6G communication networks
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |