7 µW always on Audio feature extraction with filter banks on TSMC 22nm uLL
Intel, IBM Dueling 14nm FinFETS
IEDM reveals diametrically opposed approaches
R. Colin Johnson, EETimes
10/21/2014 06:26 PM EDT
PORTLAND, OR — Every digital semiconductor manufacturer and foundry in the world is trying to build 3D FinFETS that rival Intel, which is so far leading the pack by several years. Hot on Intel's heels is IBM, which just signed a deal to turn its fabs over to GlobalFoundries (which has already licensed Samsung's FinFET process that, according to Rick Doherty, research director of The Envisioneering Group, told EE Times stems from early IBM/GlobalFoundaries discussions). TSMC, AMD, Freescale, and others claim to be hot on Intel's and IBM's trail, but have yet to prove it.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset