CyweeMotion Partners with CEVA to Offer Complete Sensor Fusion Solution for Mobile and Wearables
CyweeMotion joins CEVAnet partner program, optimizes Sensor Fusion Hub™ technology for CEVA-TeakLite-4, the industry's lowest power DSP for always-on, context aware smart devices
MOUNTAIN VIEW, Calif., Nov. 12, 2014-- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of DSP-based IP platforms for vision, audio, communications and connectivity and CyweeMotion Ltd., a leading provider of motion processing technology announced today that the companies have partnered to offer a complete sensing solution targeting mobiles and wearables. The solution integrates CyweeMotion's Sensor Fusion Hub™ software with the CEVA-TeakLite-4 DSP, to deliver a fully optimized, low power sensor fusion platform for seamless integration into any device.
CyweeMotion will present and demonstrate their Sensor Fusion Hub™ technology for the CEVA-TeakLite-4 DSP at the CEVA Technology Symposium 2014, November 17, 19, 21 in Asia. For more information, visit http://events.ceva-dsp.com/symposium-series14/.
Sensor-fusion is a critical element in today's always-on, context aware smart devices, providing motion sensing, pedestrian navigation (PDR), gesture control and contextual awareness for smartphones and wearables. Many of these functions are required to be 'always-on', resulting in significant battery drain if implemented on the main CPU or other unsuitable processors. In contrast, implementing CyweeMotion's Sensor Fusion Hub on the CEVA-TeakLite-4 DSP, allows for up to 20x power savings.
"The ultra-low power CEVA-TeakLite-4 DSP combined with our Sensor Fusion Hub technology provides an outstanding sensor hub solution for any mobile or wearable SoC," said Dr. Shun Nan Liou, General Manager at CyweeMotion Ltd. "CEVA's comprehensive development environment enabled us to port and optimize our software easily and efficiently, resulting in a highly power efficient solution, in particular for 'always-on' applications."
Moshe Sheier, director of product marketing, audio and voice at CEVA stated: "CyweeMotion's Sensor Fusion Hub is a unique addition to our CEVAnet partner ecosystem and provides a compelling offering for our CEVA-TeakLite-4 based SoC designers and system integrators by providing a full contextual awareness software suite for a host of smart devices. The CyweeMotion solution is already silicon proven, running on one of our customer's SoC, and we are currently extending this partnership with other silicon vendors and OEMs."
The CEVA-TeakLite-4 is the fourth generation DSP based on CEVA-TeakLite, the most successful licensable DSP architecture in the history of the semiconductor industry, with more than 3.5 billion chips shipped, over 100 licensees, 35 active ecosystem partners and more than 100 audio, voice and sensing software packages available. The CEVA-TeakLite-4 is offered as a scalable and extensible architecture framework, allowing customers to choose the optimal family member core to address their specific audio/voice/sensing/connectivity application needs. By taking advantage of the unified software ecosystem, a set of optimized software libraries and the integrated development environment, customers can easily reduce software development costs significantly while leveraging their software investment in future products. For more information, visit http://www.ceva-dsp.com/CEVA-TeakLite-4.
About CEVA, Inc.
CEVA is the world's leading licensor of DSP-based IP platforms for vision, audio, communications and connectivity. CEVA's IP portfolio includes comprehensive technologies for computer vision and computational photography, advanced audio and voice processing, wireless baseband (2G, 3G & 4G LTE/LTE-A), connectivity (Wi-Fi & Bluetooth) and serial storage (SATA & SAS). In 2013, CEVA's IP was shipped in more than one billion devices, including 40% of handsets shipped worldwide, powering smartphones from many of the world's leading OEMs such as Coolpad, HTC, Huawei, Lenovo, LG, Nokia, Samsung, TCL, Xiaomi and ZTE. For more information, visit www.ceva-dsp.com.
About CyweeMotion Ltd.
CyweeMotion is a leading solution provider of motion processing software, firmware, and IP for mobile, wearable, and IoT devices. The team was a spin-off from Taiwan's Industrial Technology Research Institute (ITRI) with more than ten years' experience in motion sensing technology. CyweeMotion's technology enables sensor fusion, gesture recognition, contextual awareness and pedestrian navigation (PDR) in a highly power efficient manner. Our solution powers the world's established top handset OEMs in Greater China such as HTC and Lenovo.
|
Ceva, Inc. Hot IP
Related News
- Cypher Partners with CEVA to Offer Innovative Noise Reduction Solution for Mobile, Wearables and Voice-activated Devices
- Maxscend Partners with CEVA to Offer Complete Wi-Fi and Bluetooth Solutions for Mobile Platforms, Wearables and IoT Devices
- MAXEYE License and Deploy CEVA Sensor Fusion Software in Digital Pen for Leading Global Mobile OEM
- Waves Partners with CEVA to Offer the latest Sonic Enhancement Technologies for the Mobile Market
- CEVA and Sensory Enable Power-Optimized Always-Listening Smart Wearables and Sensor Fusion Solutions via TrulyHandsfree 3.0 for CEVA-TeakLite-4 DSPs
Breaking News
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |