Moortec Semiconductor Sign Representative Agreement with Titus in South Korea
Plymouth, UK -- November 24, 2014 – Moortec Semiconductor, provider of on chip monitoring IP for advanced nodes, announce that it has signed a representative agreement with Titus, of Seoul, Korea. Titus provide design-driven sales for companies in the semiconductor sector, with a particular focus on PC-peripheral, consumer and cellular phone markets. Titus has agreed to promote Moortec's temperature, voltage and process monitoring IP products and design capabilities to the Korean semiconductor community.
“Moortec has developed compelling analog IP for advanced nodes such as 28-nanometer (nm) and finFET CMOS technologies. This includes the Moortec Embedded Temperature Sensor (METS) IP range which is an innovative, high-precision analog design targeting fine-grain DVFS, thermal monitoring and management applications. We are very excited to be working with Moortec to create and implement a business plan that will establish Moortec’s presence in Korea as an IP provider, and will generate design wins and revenue growth for the company in the region”, said Titus' Marketing Director, Tony Yoon.
"We are extremely pleased that Titus has agreed to represent us in Korea. Titus is a new and exciting sales company, providing emerging technology companies the opportunity to breakthrough into the Korean region. We look forward to enhancing our position within the Korean market with our die-sensing analog IP offerings in cooperation with Titus," said Steve Crosher, Managing Director of Moortec Semiconductor.
See www.moortec.com/PVT-IP for more information on the METS IP range.
About Moortec Semiconductor
Moortec Semiconductor deliver IP solutions targeting a wide range of application areas including consumer wireless, telecommunications, high-speed computing, networking and automotive. Specialising in embedded Process, Voltage and Temperature (PVT) sensors for advanced nodes, Moortec's IP enables System on Chip (SoC) designs to be performance optimised on a per die basis. Moortec's design expertise also includes low phase noise PLLs, DACs, ADCs and power management blocks, providing complex solutions to effectively enable your innovations. For information please visit www.moortec.com.
|
Related News
- Moortec Semiconductor Sign Representative Agreement with Acetronix in Korea
- Moortec Semiconductor Sign Representative Agreement with ChipStart
- Moortec Semiconductor Sign Representative Agreement with Red Shift Sales in Silicon Valley, US
- Moortec Semiconductor Signs Representative Agreement with Avant Technology in Taiwan
- DENSO and U.S. Startup Quadric Sign Development License Agreement for AI Semiconductor (NPU)
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |