Arteris Completes Hiring of World-Class Engineering Team to Deliver the Next Wave of On-chip SoC Communications Products
CAMPBELL, Calif., Dec. 2, 2014 -- Arteris Inc., the inventor and only supplier of silicon-proven commercial network-on-chip (NoC) interconnect IP solutions, today announced that it has completed the recruitment and hiring of its engineering team that is creating complementary products to the Arteris® FlexNoC® fabricIP, through efforts in hardware development, hardware verification and software development.
With a special emphasis on configurable on-chip memory communications, the new team of engineers will carry out efforts spearheaded by the company's engineering leadership, and continue the Arteris tradition of introducing innovation to critical areas of SoC design and assembly.
"Arteris has assembled an engineering team with some of the most accomplished and innovative people in the realm of on-chip communications," said K. Charles Janac, President and CEO of Arteris. "With experience from battery-operated smartphones to high-performance computing servers, our ranks are filled with the best interconnect experts from the likes of Apple, Intel, Broadcom, Huawei, SGI, and others. Our team members have a proven track record, having designed and built over fifteen commercially successful products implementing leading-edge technology for virtualization, cache coherency, heterogeneous multiprocessing, and security."
About Arteris
Arteris, Inc. provides Network-on-Chip interconnect IP and tools to accelerate System-on-Chip semiconductor (SoC) assembly for a wide range of applications. Rapid semiconductor designer adoption by customers such as Rambus, Altera, and Texas Instruments has resulted in Arteris being the only semiconductor IP company to be ranked in the Inc. 500 and Deloitte Technology Fast 500 lists in 2012 and 2013. Customer results obtained by using the Arteris product line include lower power, higher performance, more efficient design reuse and faster SoC development, leading to lower development and production costs. More information can be found at www.arteris.com.
|
Arteris Hot IP
Related News
- Arteris Recruits World-Class Engineering Leadership Team
- Renesas Develops Automotive SoC Functional Safety Technologies for CNN Accelerator Cores and ASIL D Control Combining World-Class Performance and Power Efficiency
- ICE-P3 EPU Upgrade Simplifies Control Of On-Chip And External Resources To Save More Power In SoC And MCU Designs
- ARM System IP boosts SoC performance from edge to cloud
- Artosyn Licenses SonicsGN On-Chip Network to Integrate Drone SoC
Breaking News
- Ceva Neural Processing Unit IP for Edge AI Selected by Nextchip for Next-Generation ADAS Solutions
- Cadence Advances AI in the Cloud with Industry-First DDR5 12.8Gbps MRDIMM Gen2 Memory IP System Solution
- Thalia joins GlobalFoundries' GlobalSolutions Ecosystem to advance IP reuse and design migration
- MosChip® to showcase Silicon Engineering Services at TSMC 2025 North America Technology Symposium
- Alphawave Semi Audited Results for the Year Ended 31 December 2024
Most Popular
- New Breakthroughs in China's RISC-V Chip Industry
- Cadence to Acquire Arm Artisan Foundation IP Business
- Analog Bits to Demonstrate IP Portfolio on TSMC 3nm and 2nm Processes at TSMC 2025 Technology Symposium
- JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
- Shifting Sands in Silicon by Global Supply Chains
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |