Wi-Fi 6 (ax)+BLEv5.4+15.4 Dual Band RF IP for High-End Applications.
Emerging NVM Express Spec Has Busy Year
Gary Hilson
EETimes (12/15/2014 10:00 AM EST)
TORONTO – NVM Express Inc. has been busy since its incorporation in March 2014.
Established as a working group under the guidance of Intel, it released the first NVM Express specification in March 2011. It outlines a standardized register interface, command, and feature set for PCIe-based storage technologies such as SSDs, designed specifically for nonvolatile memory. It is optimized for high performance and low latency, scaling from client to enterprise segments.
The initial working group dates back to 2007; the initiative fell outside the mandate of organizations in existence at the time. The primary drivers for incorporation were to give the group more clout when dealing with other standards bodies and to give members more peace of mind when sharing intellectual property.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Related News
- NVM Express Set for Busy 2018
- eMemory Won TSMC OIP Partner of the Year Award for the Outstanding Development of its NVM IP on Advanced Nodes
- NVM Express Releases NVM Express Specifications to Unify AI, Cloud, Client, and Enterprise Storage
- NVM Express Announces the Release of the Computational Storage Feature
- NVM Express Announces the Rearchitected NVMe 2.0 Library of Specifications
Breaking News
- intoPIX Powers Ikegami's New IPX-100 with JPEG XS for Seamless & Low-Latency IP Production
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
- Qualcomm initiates global anti-trust complaint about Arm
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- SiliconIntervention Announces Availability of Silicon Based Fractal-D Audio Amplifier Evaluation Board
Most Popular
- Qualcomm initiates global anti-trust complaint about Arm
- Siemens acquires Altair to create most complete AI-powered portfolio of industrial software
- Alphawave Semi Reveals Suite of Optoelectronics Silicon Products addressing Hyperscaler Datacenter and AI Interconnect Market
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- Rapidus Announces Strategic Partnership with Quest Global to Enable Advanced 2nm Solutions for the AI Chip Era