DMP Adopts Cadence Palladium XP Platform to Accelerate High Performance Graphic IP Core Development
SAN JOSE, Calif., Jan. 19, 2015 -- Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that Digital Media Professionals, Inc. (DMP) selected the Cadence® Palladium® XP platform for development of its high-performance graphic intellectual property (IP) cores. The company completed its software stack development before receiving silicon, while also achieving up to 500X simulation performance improvement versus its previous solution. DMP is a provider of 3D/2D graphics and computing IP cores targeting consumer electronics, mobile, embedded and automotive markets.
With the Palladium XP platform, and models for peripherals such as DDR3 DFI (DDR PHY Interface) and SD (secure digital) interface, DMP was able to start system emulation early to allow design exploration and pre-silicon system validation with Linux boot and GPU driver optimization.
"The Palladium XP platform allowed our design team to explore different design options with actual test patterns to select the optimum combination of performance and power," said Eisaku Ohbuchi, director and general manager of core technology development at DMP. "Additionally, the modeling capabilities of the Palladium XP platform reduced the normal man hours required for this task by two thirds."
Part of the Cadence System Development Suite, the Palladium XP platform is the industry's first high-performance, special-purpose verification computing platform that unifies best-in-class simulation acceleration and emulation capabilities in a single environment. For more information on the Palladium XP platform, visit http://www.cadence.com/news/pxp/dmp.
About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.
|
Cadence Hot IP
Related News
- Acacia Communications Adopts Cadence Palladium Z1 Enterprise Emulation Platform to Accelerate Optical Networking Development
- Altair Semiconductor Adopts Cadence Palladium XP Platform for Advanced IoT SoC Development
- Digital Media Professionals Uses Cadence Palladium XP Verification Computing Platform and Hosted Design Solutions to Speed Time to Market
- Fujitsu Adopts Cadence Palladium Z1 Enterprise Emulation Platform for Post-K Supercomputer Development
- ARM Achieves 50X Faster OS Boot-Up on Mali GPU Development using Cadence Palladium XP Platform with ARM Fast Models
Breaking News
- JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
- BrainChip Gives the Edge to Search and Rescue Operations
- ASML targeted in latest round of US tariffs
- Andes Technology Celebrates 20 Years with New Logo and Headquarters Expansion
- Creonic Unveils Bold Rebrand to Drive Innovation in Communication Technologies
Most Popular
- Cadence to Acquire Arm Artisan Foundation IP Business
- AMD Achieves First TSMC N2 Product Silicon Milestone
- Why Do Hyperscalers Design Their Own CPUs?
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- New TSN-MACsec IP core for secure data transmission in 5G/6G communication networks
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |