Wi-Fi 6 (ax)+BLEv5.4+15.4 Dual Band RF IP for High-End Applications.
Espressif Systems Internet of Things WiFi Chips Employ Cadence Tensilica Xtensa Low-Power Processor for Control and DSP
SAN JOSE, Calif., January 28, 2014—Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that Espressif Systems has utilized the Cadence® Tensilica® Xtensa® processor in its ESP8089 and ESP8266 WiFi chips that are optimized for Internet of Things (IoT) applications. The Xtensa processor, customized by Espressif to achieve the best power, performance and area results, is used both as a digital signal processor and control processor with a real-time operating system (RTOS) that runs Espressif’s WiFi and TCP/IP stacks and other application software.
For more information on the Xtensa processor, visit www.cadence.com/xtensa.
“With a rapid customization of the 32-bit ultra-low power Xtensa processor, we were able to combine the control and DSP functions into one very efficient core, conserving power and area for these very space-constrained designs,” said Teo Swee Ann, CEO of Espressif Systems. “We also utilized ultra-low voltage technology, dynamic frequency and voltage scaling, and an advanced power-control algorithm to achieve standby power consumption of less than 1.0mW and unrivaled 30uA RTC deep-sleep current consumption.”
The advantages of the Tensilica Xtensa processor include:
- The capability to integrate both performance-intensive digital signal processing (DSP) and embedded control processing functions in a single core
- The patented automated Xtensa Processor Generator, which allows designers to create differentiated features with the lowest possible power/area
About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today’s integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.
|
Cadence Hot IP
Related News
- Imec, Holst Centre and Methods2Business Develop Complete Low-Power Wi-Fi HaLow Radio Solution for Internet of Things (IoT) Applications
- MegaChips Utilizes Cadence Tensilica Xtensa Processor in Ultra-Low Power Internet of Things Sensor Hub IC
- WiLinx Licenses Tensilica's Xtensa LX2 Processor Core For Low-Power UWB Chips
- Rafael Micro Licenses Cadence Tensilica Fusion F1 DSP for Low-Power NB-IoT Modem IC
- Sonic Emotion Absolute 3D Sound Software Now Available on Cadence Tensilica HiFi Low-Power Audio/Voice Processors
Breaking News
- intoPIX Powers Ikegami's New IPX-100 with JPEG XS for Seamless & Low-Latency IP Production
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
- Qualcomm initiates global anti-trust complaint about Arm
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- SiliconIntervention Announces Availability of Silicon Based Fractal-D Audio Amplifier Evaluation Board
Most Popular
- Qualcomm initiates global anti-trust complaint about Arm
- Siemens acquires Altair to create most complete AI-powered portfolio of industrial software
- Alphawave Semi Reveals Suite of Optoelectronics Silicon Products addressing Hyperscaler Datacenter and AI Interconnect Market
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- Rapidus Announces Strategic Partnership with Quest Global to Enable Advanced 2nm Solutions for the AI Chip Era
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |