M31 Technology Adopts Cadence Verification IP to Achieve 2.5X Faster Verification
SAN JOSE, Calif., February 4, 2015—Cadence Design Systems, Inc. (NASDAQ: CDNS), today announced that M31 Technology Corporation, a professional silicon intellectual property (IP) provider has utilized Cadence’s Verification IP (VIP) products to speed up verification by 2.5X compared to manual testbench results, raise designers’ productivity and ensure better verification quality.
To learn more about Cadence® VIP products, please go to http://www.cadence.com/news/vip.
M31 Technology adopted Cadence’s VIP for PCI Express® (PCIe®) 2.0 along with the TripleCheck™ option to realize faster verification closure and comprehensive specification coverage. The VIP models interfaces such as DDR, MIPI, USB, SATA and PCIe as components that can be plugged into a system-on-chip (SoC) testbench and simulated along with the chip. Cadence’s TripleCheck IP Validator includes a test suite, coverage model and verification plan (vPlan) that simplifies pre-silicon compliance verification.
“As an IP provider, M31 Technology aims to provide customers with high-quality silicon IP services and help them reduce their time to market,” said Hsiao-Ping Lin, Chairman and CEO of M31 Technology Corporation. “Using Cadence VIP and TripleCheck solutions dramatically shortens the time that designers require to write a testbench. Most importantly, designers without verification experience can also easily perform verification tasks and achieve excellent coverage.”
Cadence is the industry VIP leader with products supporting more than 40 communication protocols and 60 memory interfaces. Cadence VIP fits into nearly every verification environment with support for all major simulators and verification languages.
About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today’s integrated circuits and electronics. Customers use Cadence software, hardware, IP and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers and research facilities around the world to serve the global electronics industry. More information about the company, its products and its services is available at http://www.cadence.com.
|
Cadence Hot IP
Related News
- Cadence Automotive Solution for Safety Verification Used by ROHM to Achieve ISO 26262 ASIL D Certification
- Renesas Adopts Cadence Interconnect Workbench to Accelerate Performance Analysis and Verification of On-Chip Interconnect
- Hitachi Adopts Cadence AMS Model-Based Methodology and Tools for Mixed-Signal Design Verification
- Sonics Adopts Cadence JasperGold Apps Formal Verification for On-Chip Network IP Development
- Spreadtrum Adopts Cadence Palladium XP II Platform for Mobile SoC and Hardware-Software Verification
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |