LEDA Systems® Introduces DBA (Direct Bump Access) FlipChip Ready I/O Library For 0.13 and 0.10-micron advanced CMOS processes

LaSer™ SerDes and SPI/SFI Integrated PHY layer Solutions implemented using DBA FlipChip Ready I/O Library

San Jose, Calif., Jul. 30, 2002, -- LEDA Systems® Inc., the leader in IP and Platforms for analog and mixed signal Systems-on-a-Chip (SoC), today announced the immediate availability of a new 0.13-micron and the soon-to-come 0.10-micron flip chip area based I/O library. This library allows the I/O to be placed anywhere in the die area and be directly routed to the flip chip bumps using DBA technology, thus rearranging I/O cells from conventional peripheral to area array format. LEDA Systems LaSer communications IP product family is available in DBA version for immediate licensing.

"Driven by the demand for better performance, chip designers are moving to flip chip interconnect structures. The inductance and resistance of wirebond introduces too much signal distortion into the I/O performance of conventional peripheral pad structure. "said Steve Kompolt, VP of Marketing of LEDA Systems.  "Today's 0.13 and 0.10  high speed designs require FlipChip I/Os to meet the speed, increase the packaging density and improve the performance."

"Kurt Wolf, Director of Library and IP Marketing at TSMC, said "Wafer solder bumping services at 0.13um are available at selected TSMC processes."

The LEDA Systems FlipChip library addresses the intellectual property needs  of the architects of today's complex IC systems.The library features Leda Systems patented Direct Bump Access Technology (DBA™) which allows the standard cells to have a direct access to the bumps without any redistribution wiring, The library  has special provisions for the whole chip ESD robustness. This I/O library can be used in various applications including high speed optical networking, wireless and graphics chip designs.Currently implemented with TSMC 0.13 micron CMOS process, the Leda Systems FlipChip I/O  IP is available to license from LEDA Systems.

"Intrinsity selected the LEDA Systems 0.13 LVDS FlipChip I/O solution in order to meet specification," said Doug Parse, VP of Engineering at Intrinsity. "The broad selection of functions combined with the special LVCMOS and SSTL2 I/Os provided a complete solution."

LEDA Systems is a leader in analog and mixed signal IP, in terms of its design expertise, breadth and depth of product line, number of engineers and number of design wins. The company offers a broad range of proven IP, including SerDes, DAC/ADC, PLLs, high-speed bus interface I/O SPI-4 Phase 2and other I/O components. LEDA's products are licensed directly to ASIC and COT design houses, and support all major foundries. LEDA's complete product line and foundry relationships provide SOC designers with one resource for all their analog and mixed-signal IP needs.

About LEDA Systems Inc.

LEDA Systems Inc., founded in 1995, is the leader in the field of analog and mixed-signal Intellectual Property design, development and licensing.  LEDA provides a single comprehensive source for analog/mixed-signal IP from special I/Os, DAC/ADC and PLLs, to high performance Serial Link Transceiver Platforms such as 5.0Gbps PHY for optical networking, 400 MHz Quad-DAC for graphics applications, etc. LEDA Systems® is a worldwide organization, headquartered in Plano, Texas, with a sales/marketing office in San Jose, California, and an engineering branch in Yerevan, Armenia. LEDA products have been licensed to more than 50 customers worldwide for the development, manufacturing and sales of high performance ICs. For more information, visit the LEDA Systems Web site at www.ledasystems.com or call 408.275.1416.

About TSMC

TSMC is the world's largest dedicated semiconductor foundry, providing the industry's leading process technology, library and IP options and other leading-edge foundry services. TSMC operates two six-inch wafer fabs and six eight-inch wafer fabs. The Company also has substantial capacity commitments at two joint ventures fabs (Vanguard and SSMC) and WaferTech. In 2000, TSMC produced the foundry industry's first 300mm customer wafers and began constructing two dedicated 300mm fabs. TSMC's corporate headquarters are in Hsin-Chu, Taiwan. More information about TSMC is available through the World Wide Web at http://www.tsmc.com .

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