TSMC to Start 10nm in 2017, Closing Gap with Intel
Alan Patterson
EETimes (2/24/2015 09:52 AM EST)
TAIPEI — Taiwan Semiconductor Manufacturing Co. (TSMC), the world’s largest chip foundry, said that it expects to start 10 nanometer production in 2017, when it will have process technology matching that of industry leader Intel Corp.
“The performance of our 10nm, in terms of speed, power and density will be equal to what we believe Intel will define as its 10nm technology,” TSMC Director of Corporate Communications Elizabeth Sun told EE Times. “Technology-wise, we think we can close the gap at 10nm.”
For the first time this year, TSMC is expected to have the largest capex in the semiconductor industry as it aims to maintain its lead in the foundry business against rivals such as Samsung, Intel and Global Foundries.
TSMC has raised its capital expenditure budget for 2015 to US$11.5-12.0 billion, an increase of 11.5-20.0 percent compared with 2014, mainly due to its confidence in demand for advanced geometries. Intel spent $10.1 billion on capex during 2014. For the current year, Intel expects that figure to hold steady, at $10 billion, plus or minus $500 million.
E-mail This Article | Printer-Friendly Page |
|
Related News
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards