How to meet the challenges of Set-Top-Boxes on Internet? Thanks to Dolphin Integration's Engineering Support team!
Grenoble, France – March 02, 2015 -- Fabless suppliers providing multimedia Systems-on-Chip (SoC) for Set-Top-Box (STB) applications have to address major challenges such as compliance to national and/or worldwide standards for both STB and audio. Moreover, they have to target the trade-offs between system performances and Bill-of-Material (BoM) costs per different market segments and customer requests.
Indeed, when a whole application schematics (ASC) or a single component is changed for BoM minimization, it is uncertain whether the standard and system-level performances will be met. A considerable amount of time is then needed to change the ASC, its associated test board and its measurements, to make sure that all the criteria in the diverse standards are met: SNR, THD, crosstalk, frequency response…
Fortunately, Dolphin Integration does not only provide audio converters for STB application but also offers a thorough support by its Integration and Application Engineers (IAE). Upon analyzing customer’s integration and application constraints, they propose solutions fitting requested standards and finally provide various optimizations at SoC and system level to enhance customers’ differentiators.
Ultimately, application schematics for selected performance trade-offs are simulated with proper documentation for third parties: the equipment designers. Typically, the fabless suppliers need to provide competitive application schematics for smart trade-offs between the system performances and the BoM, depending on final application or targeted standard, as demonstrated on the illustration below.
Dolphin Integration’s Senior Integration and Application Engineering Manager, David Carlioz, explained why the IAE support is unique: “We are able to provide different and robust application schematics, without our users needing to verify each one in the lab, thanks to the combination of three major factors:
- The methodology of Application Hardware Modelling (AHM), which we have developed over five years, allows us to follow a meticulous process from the identification of potential integration and application risks, to the simulation results, with equivalence checking through the lab measurements.
- Our secret weapon, the truly mixed-signal simulator “SMASH”, enables simulation across the border of integration (SoC) and application (PCB) sides. It can be combined with:
- the schematic editor “SLED” for easy and visual model parameterization and composition
- the estimator “Scrooge” for hierarchical evaluation of power consumption to help smoothly build the simulation environment according customer’s request.
- IAE and system architects’ expertise on accurately identifying the relevant risks and the modelling know-how and availability of generic models (reproducing critical noise transfer functions), enables us to get the right models for a defined composite trial path to solve a real issue.
Our IAE support is made possible thanks to the simultaneous presence of the ingredients (Silicon IP and relevant models), the set of tools, the methodology and our know-how.”
For more information, contact our marketing manager of audio converters at converters@dolphin-ip.com or take a look at our product presentation.
About Dolphin Integration
Dolphin Integration contributes to "enabling mixed signal Systems-on-Chip" for worldwide customers - up to the major actors of the semiconductor industry - with Silicon IP components best at low-power consumption.
This wide offering is based on innovative libraries of standard cells, register files, memory generators and power regulators. Complete networks for power supply can be flexibly assembled together with their loads: from high-resolution converters for audio and measurement applications to power-optimized micro-controllers of 8 or 16 and 32 bits.
Over 30 years of diverse experiences in the integration of silicon IP components and providing services for ASIC/SoC design and fabrication, with its own EDA solutions solving unaddressed challenges, make Dolphin Integration a genuine one-stop shop covering all customers’ needs for specific requests.
The company striving to incessantly innovate for its customers’ success has led to two strong differentiators:
- state-of-the-art “configured subsystems” for high-performance applications securing the most competitive SoC architectural solutions,
- a team of Integration and Application Engineers supporting each user’s need for optimal application schematics, demonstrated through EDA solutions enabling early performance assessments
Its social responsibility has been from the start focused on the design of integrated circuits with low-power consumption, placing the company in the best position to now contribute to new applications for general power savings through the emergence of the Internet of Things.
|
Dolphin Design Hot IP
Related News
- Do more with less energy! What's behind Dolphin Design's Energy Efficient Platforms?
- Minimizing BoM cost and silicon area thanks to Dolphin Integration's iLR-LaDiable capless regulator
- Dolphin Integration unveils the new generation of PWM audio DAC for Set-Top-Boxes at 28 nm and 40 nm
- Genesys and Dolphin Integration announce their renewed cooperation in the field of microcontroller thanks to the quality of support
- Why have all broadcast powerhouses embraced intoPIX JPEG XS? Unraveling the secret behind industry leaders' unanimous adoption!
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |