Silicon Line GmbH Closes an Investment Round of 6.3 Million Euro
MUNICH-- March 12, 2015 -- Silicon Line GmbH today announced that the Company successfully raised Euro 6.3 M from new and existing investors, Limburgse Reconversie Maatschappij NV, Hasselt Belgium, MVP Fund I and II GmbH & Co. KG, Munich, and Capital-E I and II Arkiv Comm. V.A, Antwerp.
Silicon Line is a worldwide leader in developing IC’s and integrated solutions for high speed optical connections, based on proprietary low power designs and Optical Sub Assembly (OSA) technology. With this investment Silicon Line will finance the build-up of volume manufacturing of OSA’s at the Corda Campus, Hasselt, Belgium and accelerate the implementation of the next generation of high speed optical connections needed for Virtual Reality connections, Internet Of Things and 4K, 8K displays. Silicon Line existing solutions already support HDMI 1.4 and 2.0, USB 3.1 up to 10 Gbps, DisplayPort 1.3 and MIPI D-PHY for cameras.
“We are very glad about this new investment from new shareholders. The invested capital will help us to industrialize and broaden our technology platform together with a larger number of existing and new customers. It will also increase the rate of our international expansion and allow us to have a stronger market presence in EU, China and the US where we expect rapid sales growth in the coming years. The worldwide market for our products is enormous and the capital infusion will accelerate our growth in the on-going industry-shift towards higher communication speeds where optical is the obvious way to go”, says Ruud van der Linden, CEO Silicon Line.
About Silicon Line:
Silicon Line is a leading global provider of innovative ultra-low power optical link technology for mobile and consumer electronics markets. Silicon Line products enable the power-efficient optical transportation of video, images, voice and data at the multi-gigabit speeds demanded by both today and tomorrows digital consumer lifestyles. We produce a wide range of single channel and four channel VCSEL drivers and TIAs ranging in speed from 20 Mbps to 12.5 Gbps. The industry leading ultra-low power consumption of our products makes them ideally suited for consumer as well as datacom/telecom, industrial, security and medical applications. We also produce dedicated products for USB3.0, USB3.1, HDMI1.4, HDMI2.0 and MIPI D-PHY applications.
|
Related News
- Valens Semiconductor Closes $14 Million Investment B Round
- Silicon Hive spins out from Philips; New Venture Partners leads $10 million investment round, joined by TVM Capital and Philips
- Atmos Corporation closes $US 10 million investment round; Virage Logic leads investors
- Hailo Closes New $120 Million Funding Round and Debuts Hailo-10, A New Powerful AI Accelerator Bringing Generative AI to Edge Devices
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
Breaking News
- intoPIX Powers Ikegami's New IPX-100 with JPEG XS for Seamless & Low-Latency IP Production
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
- Qualcomm initiates global anti-trust complaint about Arm
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- SiliconIntervention Announces Availability of Silicon Based Fractal-D Audio Amplifier Evaluation Board
Most Popular
- Qualcomm initiates global anti-trust complaint about Arm
- Siemens acquires Altair to create most complete AI-powered portfolio of industrial software
- Alphawave Semi Reveals Suite of Optoelectronics Silicon Products addressing Hyperscaler Datacenter and AI Interconnect Market
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- Rapidus Announces Strategic Partnership with Quest Global to Enable Advanced 2nm Solutions for the AI Chip Era
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |