In 2020, 10nm Will Occupy 55% of Revenue: TSMC
By Vincent Wang, CTIMES
Mar 19,2015
TAIPEI, Taiwan — Mark Liu, Co-Chief Executive Officer and Co-President at Taiwan Semiconductor Manufacturing Company (TSMC) gave a speech under the topic “Growth Beyond Mobile” on March 18, referring to Internet of Things (IoT) will be the main growth driver of semiconductor industry, he further forecast that the 10nm will occupy 55 percent of revenue in 2020.
E-mail This Article | Printer-Friendly Page |
Related News
- 5G and HPC Drive 45% Q1 Revenue Growth at TSMC
- Gartner Says Worldwide Semiconductor Revenue Grew 10.4% in 2020
- Revenue of Top 10 IC Design (Fabless) Companies for 2020 Undergoes 26.4% Increase YoY Due to High Demand for Notebooks and Networking Products, Says TrendForce
- SmartDV 2020 Revenue Increases by 51%
- Gartner Says Worldwide Semiconductor Revenue Grew 7.3% in 2020
Breaking News
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards