GUC Relocates North America
Growth Fuels Office Move
Hsin-chu, Taiwan, March 25, 2015 - Global Unichip Corp. (GUC), the Flexible ASIC LeaderTM, today relocated its North American Office to 2851 Junction Ave. Suite 101, San Jose, California.
The new office accommodates a growing engineering staff and expanded technical capabilities demanded by a robust US market. Among its amenities, the new office will host direct conferencing capabilities with the company's Taiwan headquarters to enhance business and technical collaboration.
GUC reports that its North American business continues to grow at a healthy pace. Last year, the North American market contributed 33% to the total 2014 revenue.
"This move represents a significant step forward, one that is strategically necessary to meet the increasingly complex demands or our rapidly-expanding base of ASIC customers," explained Jim Lai, President of GUC.
"The growth in our engineering department is in response to our customers' growing appreciation for what we bring to their core competencies. This move really allows us to take these services to the next level," said Jerry C. Chen, head of the North America office.
About GUC
GLOBAL UNICHIP CORP. (GUC) is the Flexible ASIC LeaderTM who provides the semiconductor industry with leading IC implementation and SoC manufacturing services. Based in Hsin-chu Taiwan, GUC has developed a global reputation with a presence in China, Europe, Japan, Korea, and North America. GUC is publicly traded on the Taiwan Stock Exchange under the symbol 3443. For more information, visit www.guc-asic.com.
|
Related News
- Silex Insight expands into North America with opening of Silicon Valley office
- M2000 Opens Silicon Valley Office Serving eFPGA Customers Throughout North America
- Secure-IC unveils its Securyzr™ neo Core Platform at Embedded World North America 2024
- Alphawave Semi and Arm to Present on Chiplets for Architecting Next-Generation Terabit AI Networks at the TSMC OIP Ecosystem Forum North America
- TSMC Celebrates 30th North America Technology Symposium with Innovations Powering AI with Silicon Leadership
Breaking News
- HPC customer engages Sondrel for high end chip design
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- TSMC drives A16, 3D process technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
E-mail This Article | Printer-Friendly Page |