Xilinx Highlights Multiple Next Generation Ethernet, SDN and Data Center Acceleration Technologies at Ethernet Technology Summit 2015
SAN JOSE, Calif., April 6, 2015 -- Xilinx, Inc. (NASDAQ: XLNX) today announced it will highlight multiple next generation Ethernet, SDN and data center acceleration technologies in presentations and demonstrations at Ethernet Technology Summit 2015. To learn more, join Xilinx at the presentations listed below or visit us at ETS Booth #100, April 15 - 16, at the Santa Clara Convention Center, Santa Clara, CA.
Xilinx Conference Participation
Wednesday, April 15
8:30 am – 9:40 am, Forum 1A
Why 25GbE Is the Best Choice for Data Centers by Gilles Garcia, Director of Wired Communications at Xilinx
This presentation discusses how 25G Ethernet IP for FPGAs addresses throughput challenges in data centers, offers new opportunities to upgrade 10G connectivity, helps reduce data center TCO, and delivers a large performance increase for servers and top of rack switches.
9:50 am – 10:50 am, Forum 1A
400GbE: Current Status and Issues by Mark Gustlin, Principal System Architect at Xilinx
An update will describe 400GbE current status and the major issues under consideration, including current thinking about the architecture. The issue of defining logic layers to support the requirements of carrying 400 Gb/s of data across up to 16 physical lines with complex encoding needs will be discussed.
3:20 pm – 4:25 pm, Session B
Maximizing Application Acceleration with FPGAs by Shreyas Shah, Data Center Architect at Xilinx
This presentation provides an in-depth understanding of FPGA applicability in application acceleration markets and the significant role FPGA plays in data centers.
4:50 pm – 5:40 pm, Forum 1C
FlexEthernet: A Single Protocol for All Ethernet Interfaces by Mark Gustlin, Principal System Architect at Xilinx
Learn how FlexEthernet is being defined and how a FlexEthernet interface operates. Details of the proposed protocol and how it coexists with existing Ethernet will be discussed.
Thursday, April 16
8:30 am – 9:40 am, Forum 2A
Implementing SDN in FPGAs over All Gigabit-Level Ethernet Standards by Gordon Brebner, Distinguished Engineer at Xilinx
This talk explains how the Xilinx® SDNet™ design environment allows the specification of packet processing data planes for software defined networking, and how it can provide the automatic compilation of the same high-level specification to hardware implementations that operate in the 1G to 400G range. It will also discuss how FPGA technology can be deployed without deep hardware expertise and without requiring different hardware for differing Ethernet speeds and differing packet processing functions.
9:50 am – 10:50 am, Forum 2A
Ethernet in Cloud Radio Access Network (RAN) Fronthauling by Harpinder Matharu, Senior Product Manager at Xilinx
This presentation discusses how use of Ethernet in the Cloud RAN fronthaul, while identifying associated challenges, could act as a catalyst to the adoption of SDN/NFV technologies in the wireless infrastructure.
9:50 am – 10:50 am, Session A
400GbE Core Routing Implementation by Paul Mooney, Senior Product Marketing Manager at Spirent, Wael Diab, Senior Director at Huawei, and Gilles Garcia, Director of Wired Communications at Xilinx.
In this session Huawei, Xilinx and Spirent will discuss their collaboration on an operational 400GbE link using the Huawei N5000E core routing platform, Xilinx® Virtex®-7 FPGAs and the Spirent TestCenter 400GbE test module.
Xilinx Demonstrations – Booth #100
Single Chip 400GE Solution Featuring the Virtex UltraScale Device
This end-to-end solution demonstration showcases the industry's first single-chip 400GbE solution featuring the Xilinx® Virtex® UltraScale™ VU095 device connected to four sets of Sumitomo Electric CFP4 LR4 modules, connected to the Spirent Communications 400GE test solution with four sets of Oclaro CFP2 LR4 modules.
Low Latency 4x25G Ethernet MAC Solution
This demonstration utilizes the Virtex UltraScale VCU107 board with the Xilinx low latency 25G Ethernet MAC IP supporting the 25G Ethernet Consortium specification.
About Xilinx
Xilinx is the world's leading provider of All Programmable FPGAs, SoCs and 3D ICs. These industry-leading devices are coupled with a next-generation design environment and IP to serve a broad range of customer needs, from programmable logic to programmable systems integration. For more information, visit www.xilinx.com.
|
Xilinx, Inc. Hot IP
Related News
- Xilinx Showcases All Programmable Solutions for Cloud and Data Center Flash Storage at Flash Memory Summit 2015
- Xilinx Showcases Smarter Solutions for Data Center Flash Storage and Application Acceleration at Flash Memory Summit 2014
- Xilinx Software Defined Development Environment for Data Center Acceleration Now Available on Amazon Web Services
- Xilinx Expands its 16nm UltraScale+ Product Roadmap to Include Acceleration Enhanced Technologies for the Data Center
- Xilinx Delivers the Industry's Most Flexible and Comprehensive Ethernet Portfolio for Data Center Interconnect, Service Provider and Enterprise Applications
Breaking News
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |