GUC Demonstrates Industry's First TSMC 16nm Low Leakage USB 3.1 PHY IP
Hsinchu, Taiwan, April 7, 2015 - Global Unichip Corp. (GUC), the Flexible ASIC LeaderTM, today announced industry's first low leakage USB 3.1 PHY IP developed for TSMC's 16-nanometer FinFET+ process. The new IP will be available on June 15.
This 16nm USB3.1 PHY IP is silicon-proven. It supports USB2.0, 3.0 and 3.1 protocols and is ready for USB Type-C connector, targeting data transfer and appliance charging functions. Ultra low-power consumption makes it ideal for consumer applications including mobile, laptops and tablet.
GUC's USB 3.1 PHY is compliant with USB 3.1 Base Specification with data rates up to 10Gb/s. It supports PRBS Built-In Self-Test and various loopback modes. The reference clock frequency is selectable among 20/25/40/50/100MHz.
GUC will demonstrate USB3.1 PHY at the TSMC Technology Symposium being held in San Jose, California today. GUC-PHY will be further verified with Renesas’ USB3.1 host controller IP, which together will provide USB 3.1 PHY + controller total solution on 16FF+.
"The addition of the USB 3.1 PHY IP to our 16nm portfolio truly provides the ASIC and design communities with a very broad range of advance technology options to meet nearly every leading edge design coming through the value chain. The interoperability between the Renesas controller IP and GUC PHY definitely provides the most advanced USB3.1 total solution, " said Jim Lai, President of GUC.
GUC's in-house IP portfolio includes DDR, high-speed SerDes, data converter, hardened ARM core, and multimedia IP. GUC's IP eco-system provides the flexibility to work with IP from GUC, TSMC and other vendors, creating the widest range of design options.
About GUC
GLOBAL UNICHIP CORP. (GUC) is the Flexible ASIC LeaderTM who provides the semiconductor industry with leading IC implementation and SoC manufacturing services. Based in Hsin-chu Taiwan, GUC has developed a global reputation with a presence in China, Europe, Japan, Korea, and North America. GUC is publicly traded on the Taiwan Stock Exchange under the symbol 3443. For more information, visit www.guc-asic.com.
|
Related News
- ASMedia Technologies Demonstrates Industry's First SuperSpeed USB 10 Gbps (USB 3.1) PHY at USB-IF Annual Members Meeting
- ASMedia Technologies Demonstrates Industry's First SuperSpeed USB 10 Gbps (USB 3.1) Silicon ASM1352R (USB3.1 to SATA6G with RAID) at Intel Developer Forum
- Fresco Logic Demonstrates Industry's First SuperSpeed USB 10 Gbps (USB 3.1) Data Transfer
- M31 demonstrates high-speed interface IP development achievements on TSMC's 7nm & 5nm process technologies
- TSMC 12FFC silicon proven SERDES Phy IPs' for HDMI 2.1, PCIe Gen5, DDR4, USB 4 & MIPI Interfaces available immediately for your next SoC
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |