2-stage Power Amplifier 39GHz ultra-efficient Dual-Drive™ PA
eASIC Joins Hybrid Memory Cube Consortium
Santa Clara, CA – April 7, 2015 – eASIC Corporation, a fabless semiconductor company that delivers a custom integrated circuit (IC) platform (eASIC Platform), today announced that it has joined the Hybrid Memory Cube Consortium. The organization includes more than 150 members dedicated to the development and establishment of an industry-standard interface specification for Hybrid Memory Cube (HMC) technology.
“eASIC is delighted to join the HMC Consortium as a key contributor to the advancement of an industry standard interface which is being adopted in the market place for high performance storage and data center designs,” said Jasbinder Bhoot, Vice President of Worldwide Marketing at eASIC. “HMC technology is overcoming the limitations of current and near-term memory architectures to deliver greater levels of bandwidth, power efficiency and reliability, proving a good match for stringent system-level design requirements.”
The HMC Consortium is a working group made up of industry leaders that build, design-in or enable HMC memory technology. The goal of the consortium is to facilitate HMC integration into a wide variety of systems, platforms and applications by defining an adoptable, industry-wide interface that enables developers and manufacturers to innovate and expand the capabilities of the next generation of memory-based solutions.
About eASIC
eASIC is a semiconductor company offering a differentiated solution that enables us to rapidly and cost-effectively deliver custom ICs, creating value for our customers’ hardware and software systems. Our eASIC solution consists of our eASIC platform which incorporates a versatile, pre-defined and reusable base array and customizable single-mask layer, our ASICs, delivered using either our easicopy or standard ASIC methodologies, and our proprietary design tools.
We believe this innovative technology allows eASIC to offer the optimal combination of fast time-to-market, high performance, low power consumption, low development cost and low unit cost for our customers. eASIC Corporation is headquartered in Santa Clara, California. Investors include Khosla Ventures, Crescendo Ventures, Seagate Technology, Kleiner Perkins Caufield and Byers (KPCB) and Evergreen Partners.
|
Related News
- Hybrid Memory Cube Consortium Advances Hybrid Memory Cube Performance and Industry Adoption With Release of New Specification
- Hybrid Memory Cube Consortium Heralds 2013 as Turning Point for High-Performance Memory ICs, Gains Rapid Consensus for Final Specification and Decision to Renew Consortium
- Consortium to Accelerate Dramatic Advances in Memory Technology Announces New Members
- Synopsys Delivers Next-Generation Verification IP for Micron's Hybrid Memory Cube Architecture
- TekStart and Pico Computing Partner to Deliver Hybrid Memory Cube (HMC) Intellectual Property (IP) Solutions for Networking, Computing, and Processing Markets
Breaking News
- GUC Joins Arm Total Design Ecosystem to Strengthen ASIC Design Services
- QuickLogic Announces $6.575 Million Contract Award for its Strategic Radiation Hardened Program
- Micon Global and Silvaco Announce New Partnership
- Arm loses out in Qualcomm court case, wants a re-trial
- Jury is out in the Arm vs Qualcomm trial
Most Popular
- Arm loses out in Qualcomm court case, wants a re-trial
- Micon Global and Silvaco Announce New Partnership
- Jury is out in the Arm vs Qualcomm trial
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
- QuickLogic Announces $6.575 Million Contract Award for its Strategic Radiation Hardened Program
E-mail This Article | Printer-Friendly Page |