NXP Secure Element Adopted by Samsung Galaxy S6 in World's Largest Smartphone Market
Eindhoven, Netherlands, May 7, 2015 – NXP Semiconductors N.V. (NASDAQ: NXPI) today announced that its secure element, SmartMX (P61) has been selected for Samsung’s flagship smartphone, the Galaxy S6, in China, the world’s largest smartphone market, for mobile payment solutions. With the NXP embedded secure element, and NFC technology, SamsungPay enables contactless payment with security and data protection for end users.
“China, as the world’s largest smartphone market, is a key region for our technology,” said Jeff Miles, vice president of payments, NXP Semiconductors. “The NXP secure element, the only common criteria certified EAL6+ product for mobile applications, provides the highest level of data protection and encryption to end users, payment issuers, and smartphone manufacturers.”
The Flash based P61N1M3 IC secure element is powered by the highly secured Smart MX2 technology and embeds the latest generation of JavaCard OS from NXP, enabling the broadest range of services including payment, transit and access control. The solution can be easily integrated on Android devices with the NXP secure element software suite.
About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ: NXPI) creates solutions that enable Secure Connections for a Smarter World. Building on its expertise in High Performance Mixed Signal electronics, NXP is driving innovation in the application areas Connected Car, Security, Portable & Wearable and Internet of Things. NXP has operations in more than 25 countries, and posted revenue of $5.65 billion in 2014. Find out more at nxp.com.
|
NXP Hot IP
Related News
- NXP's New SmartMX2 P60 Step-Up! Secure Element is Enabled with Intrinsic-ID's Technology to Provide Secure Authentication and Confidential Data Exchange
- Tiempo Secure's TESIC RISC-V IP Secure Element successfully characterized on GlobalFoundries' 22FDX technology node
- Siemens' new Calibre DesignEnhancer boosts Samsung Foundry design quality and speeds time to market
- Samsung Sounds Alarm About '22 Chip Market Landing
- Tiempo Secure Selects IC'Alps to Accelerate Silicon Implementation of Secure Element IP for IoT Applications
Breaking News
- Arm loses out in Qualcomm court case, wants a re-trial
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
Most Popular
E-mail This Article | Printer-Friendly Page |