English
Kilopass to Demonstrate NVM IP at UMC Technology Forums in Japan, China
Update: Synopsys Expands DesignWare IP Portfolio with Acquisition of Kilopass Technology (Jan. 10, 2018)
Will Illustrate NVM IP’s Ultra Low Power, High Performance and Capacity, Fast Access Speed, 10-Year Data Retention
SAN JOSE, CALIF. –– May 20, 2015 ––
WHO: Kilopass Technology, Inc., a leading provider of semiconductor logic non-volatile memory (NVM) intellectual property (IP)
WHAT: Will feature its NVM IP’s ultra low-power and high-performance features, fast access speed, megabits of capacity and more than 10 years of data retention at the upcoming United Microelectronics Corporation (UMC) Technology Forums in Japan and China. Kilopass will demonstrate why antifuse technology is the future NVM foundation IP, replacing eFuse below 16 nanometer.
WHEN and WHERE:
Wednesday, May 27, from 9:30 a.m. until 5 p.m.
Tokyo International Forum, Hall B7
Tokyo, Japan
Friday, June 5, from 9:30 a.m. until 5 p.m.
Kerry Hotel
Shanghai, China
Information about Kilopass and its NVM IP is available at: www.kilopass.com
The UMC website is located at: www.umc.com
About Kilopass
Kilopass Technology, Inc., is the leader in embedded non-volatile memory (NVM) intellectual property (IP). Its patented technologies of one-time programmable (OTP) NVM solutions have boundless capacity to scale to advanced CMOS process geometries. They are portable to every major foundry and integrated device manufacturer (IDM), and meet market demands for increased integration, higher densities, lower cost, low-power management, better reliability and improved security. Trusted by today's best-known brands, Kilopass' technology has been integrated by more than 170 customers, with 10--billion units shipped in over 400 industrial, automotive, consumer electronics, mobile and analog and mixed-signal chip designs, and internet of things (IoT). For more information, visit www.kilopass.com or email info@kilopass.com.
|
||||||
Related News
- Credo First to Publicly Demonstrate 112G SerDes in 7nm at TSMC's 2018 China OIP Forum
- Kilopass Spans the Globe Next Week to Participate at GSA European Executive Forum, Internet of Things Developers Conference in the U.S., TSMC Technical Symposium in China
- Kilopass to Present "SoC for IoT: Antifuse NVM for Security and Low Power" at IIC China Spring Smart Devices Conference
- Kilopass' Gusto Ultra-Low Power NVM IP for Code Storage Enabled on UMC 55nm LP Process
- Kilopass to Exhibit at Five TSMC 2014 Technology Symposium Events in China, Taiwan, The Netherlands, Israel, Japan
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
|
E-mail This Article | 
|
|
Printer-Friendly Page |