Samsung Ramps 10nm in 2016
FinFET Roadmap Aligns with TSMC's Plans
Jessica Lipsky, EETimes
5/22/2015 01:50 AM EDT
SAN FRANCISCO -- Samsung announced its next-generation process technology, a 10nm FinFET node, at a company event here. The announcement comes a month after Samsung detailed its 14nm process.
Samsung was shy on specs, but said the process node will be in full production by the end of 2016, about the same time as its rival TSMC. The Samsung 10nm process offers “significant power, area, and performance advantages” and targets a broad range of markets, said foundry senior vice president Hong Hao.
E-mail This Article | Printer-Friendly Page |
|
Related News
- Efinix Partners with Samsung to Develop Quantum eFPGAs on 10nm Silicon Process
- Samsung Starts Mass Production of Its 2nd Generation 10nm FinFET Process Technology
- Cadence DFM Signoff Solutions Achieve Qualification for Samsung 28nm FD-SOI/14nm/10nm Process Technologies
- Rambus Partners with Samsung to Develop 56G SerDes PHY on 10nm LPP Process
- Samsung Completes Qualification of its 2nd Generation 10nm Process Technology
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards