400G ultra low latency 56/112G FEC and SERDES IP sub 10ns latency
LogicVision And SiidTech Form Strategic Alliance to Explore Silicon Fingerprinting Usage and Embedded Test
San Jose, Calif., August 20, 2002 - LogicVision, Inc., (NASDAQ:LGVN), a leading provider of embedded test solutions for integrated circuits and systems, today announced a strategic partnership with SiidTech Inc., a pioneer and provider of the die identification technology, Silicon Fingerprinting™. The partnership will explore the advancement, utilization and potential of silicon fingerprinting and embedded test in application-specific integrated circuit (ASIC) and system on chip (SoC) technologies and revenue opportunities in silicon die ID and embedded test.
SiidTech's innovative technology provides the ability to identify uniquely each silicon die whether on a wafer or packaged. This capability - based on the same principle of human fingerprinting that no two silicon dies are the same - provides for many tracking and functionality options not possible with current ID and tracing methodologies. This technology, combined with embedded test, can provide test and yield management possibilities well beyond the wafer level to packaged parts. Complementary applications between the two companies include enhancing yields, significantly reducing debug and final test times, and more efficient field diagnostics. Combining SiidTech's Fingerprinting technology with LogicVision's embedded test could have a profound effect on closing the gaps between chip design, chip manufacturing through to systems development.
Mukesh Mowji, vice-president of sales and marketing at LogicVision, said, "Our partnership with Siidtech reflects our ongoing drive to expand the markets currently served by LogicVision and our embedded test solutions. Our goal is to create new applications for our customers, which add value throughout the entire design and manufacturing process. With SiidTech's fingerprinting die identification our mutual customers will not only be able use the unique information to correlate with embedded test data but also to use this information in their end applications."
"Partnering with the leading embedded test provider, LogicVision, enables us to explore technological possibilities that we couldn't with another provider," noted Steve Sapiro, vice-president of marketing at SiidTech. "These types of collaborations are thrilling because they often spawn new ways to look at old problems, or the next 'big thing' in our industry."
About LogicVision Inc.
LogicVision (NASDAQ: LGVN) provides proprietary technologies for embedded test that enable the more efficient design and manufacture of complex semiconductors. LogicVision's embedded test solution allows integrated circuit designers to embed into a semiconductor design test functionality that can be used during semiconductor production and throughout the useful life of the chip. For more information on the company and its products, please visit the LogicVision website at www.logicvision.com .
Forward-Looking Statements
Except for the historical information contained herein, the matters set forth in this press release, including statements as to the expected benefits of the strategic alliance between LogicVision and SiidTech, are forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. These forward-looking statements are subject to risk and uncertainties that could cause actual results to differ materially, including, but not limited to, the impact of competitive products and technological advances, the success of the strategic alliance, and other risks detailed in LogicVision's Form 10-Q for the quarter ended June 30, 2002, and from time to time in LogicVision's SEC reports. These forward-looking statements speak only as of the date hereof. LogicVision disclaims any obligation to update these forward-looking statements.
LogicVision, Embedded Test, LogicVision Ready and LogicVision logos are trademarks or registered trademarks of LogicVision Inc. in the United States and other countries. All other trademarks and service marks are the property of their respective owners.
|
Related News
- Siemens' Tessent In-System Test software enables advanced, deterministic testing throughout the silicon lifecycle
- Cryptomathic and PQShield form strategic alliance to offer PQC solutions for code signing and data protection in compliance with latest NIST and CNSA recommendations
- MIPI DevCon Returns to Silicon Valley to Explore MIPI in Automotive, IoT and Mobile
- Renesas Electronics to acquire Nokia's wireless modem business; companies to form strategic business alliance for modem technology development
- Mentor Graphics Outlines Strategy to Unify Silicon Test and Yield Analysis
Breaking News
- GUC Joins Arm Total Design Ecosystem to Strengthen ASIC Design Services
- QuickLogic Announces $6.575 Million Contract Award for its Strategic Radiation Hardened Program
- Micon Global and Silvaco Announce New Partnership
- Arm loses out in Qualcomm court case, wants a re-trial
- Jury is out in the Arm vs Qualcomm trial
Most Popular
- Arm loses out in Qualcomm court case, wants a re-trial
- Micon Global and Silvaco Announce New Partnership
- Jury is out in the Arm vs Qualcomm trial
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
- QuickLogic Announces $6.575 Million Contract Award for its Strategic Radiation Hardened Program
E-mail This Article | Printer-Friendly Page |