Chips&Media releases CFrame30, its groundbreaking hardware design for Lossy Frame Buffer Compression
Seoul, Korea - June 17, 2015 -- Chips&Media Inc. completed the development of its lossy frame buffer compression IP, CFrame30 last month and has now started to provide their newest IP to the customers. This is a subsequent launch after CFrame10 – its lossless frame compression IP was introduced in 2014.
CFrame30 is able to compress diverse color formats of video frame including YUV420/422/444 (8-12bit), RGB, and Bayer at a constant rate up to 75%. With the fully hardwired implementation consisting of simply Compressor and Decompressor, it delivers a 1 pixel per cycle throughput and a very low gate count. Boosting up speed is also predictable to meet what customers demand.
Above all, this IP is fully configurable in order customers to get fully customized IP for their own needs. Selection of a compression rate, number of plane(s), input/output sample mode, and integration of DMAC can lead to a different logic and memory size.
CFrame30 aims at helping many SoC vendors who make their efforts to reduce systemwide use of memory. Chips&Media’s original compression algorithm can make them realize a tremendous amount of bandwidth reduction along with near-lossless, amazing picture quality and help develop many more competitive SoC solutions with image sensor, ISP, video codec, or display.
About Chips&Media
Chips&Media is a leading video IP provider based in Seoul, Korea(Republic of). Its advanced ultra-low power and high performance video technology has been chosen by more than 70 top-tiers based in US, Europe, Korea, Taiwan, China and Japan and has proven in silicon reaching 260 millions of units. For more information, please visit the company’s web site at www.chipsnmedia.com
|
Chips&Media Hot IP
Related News
- Chips&Media releases CFrame10, its new hardware design for frame buffer compression
- New Lossless & Lossy Hybrid frame buffer compression IP, CFrame50 released by Chips&Media
- Artosyn selects Chips&Media Lossy&Lossless Compression IP for Drone, Robots, AR, and VR SoCs
- Frame Buffer Compression IP Subsystem for TCON IC Manufacturers Launched by Hardent
- Silicon IP Provider Chips&Media Launches AV1 Video Encoder Hardware IP for 4K/UHD Video Resolutions and Beyond
Breaking News
- JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
- BrainChip Gives the Edge to Search and Rescue Operations
- ASML targeted in latest round of US tariffs
- Andes Technology Celebrates 20 Years with New Logo and Headquarters Expansion
- Creonic Unveils Bold Rebrand to Drive Innovation in Communication Technologies
Most Popular
- Cadence to Acquire Arm Artisan Foundation IP Business
- AMD Achieves First TSMC N2 Product Silicon Milestone
- Why Do Hyperscalers Design Their Own CPUs?
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- New TSN-MACsec IP core for secure data transmission in 5G/6G communication networks
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |