English
High Customer Interest in FD-SOI, Globalfoundries Says
Dylan McGrath, EETimes
7/16/2015 00:00 AM EDT
SAN FRANCISCO --Customer interest is unusually high in Globalfoundries’ newly announced 22nm fully depleted silicon-on-insulator (FD-SOI) manufacturing platform, which could be in high-volume manufacturing by the middle of 2017, a company executive said at the Semicon West tradeshow here.
Customers were so eager to get to work on designs for the process technology that they persuaded Globalfoundries (Santa Clara, Calif.) to take the unusual step of devoting a small amount of space on process technology qualification vehicle (TQV) test chips to critical intellectual property from key customers, said Subramani Kengeri, vice president of global design solutions at Globalfoundries.
|
E-mail This Article | 
|
|
Printer-Friendly Page |
|
||||||
Related News
- Attopsemi's I-fuse OTP IP Qualified and Available on GLOBALFOUNDRIES 22FDX FD-SOI Platform
- VeriSilicon Releases Most Advanced FD-SOI Design IP Platform on GLOBALFOUNDRIES 22FDX for Edge AI and IoT Applications
- Attopsemi's I-fuse OTP Passed 3 lots of HTS and HTOL Qualification for 1,000hr on GLOBALFOUNDRIES 22FDX FD-SOI Technology
- GLOBALFOUNDRIES and Dolphin Integration to Deliver Differentiated FD-SOI Adaptive Body Bias Solutions for 5G, IoT and Automotive Applications
- Attopsemi's I-fuse OTP worked at 0.4V and 1uW read on GLOBALFOUNDRIES 22nm FD-SOI for Fraunhofer Institute for Photonic Microsystems' (IPMS) battery-less 61GHz RFID tags
Breaking News
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
- RaiderChip Hardware NPU adds Falcon-3 LLM to its supported AI models