Via Licensing Issues Call for MPEG-H 3D Audio Patents
San Francisco, August 20, 2015—Via Licensing Corporation, the leading administrator of licensing programs for standardized audio technologies, today announced a call for patents that are essential to the practice of the MPEG-H 3D Audio standard.
MPEG-H is the latest set of audio/video compression and transmission technologies to be standardized under the auspices of the ISO/IEC Moving Picture Experts Group (MPEG). MPEG-H 3D Audio specifies the transmission and playback of audio over a variety of speaker arrangements for broadcast and streaming applications in diverse environments such as home theater settings, automotive systems, headphones, and mobile devices.
“Adding an MPEG-H 3D Audio patent pool to our existing portfolio of audio licensing programs makes tremendous sense for our customers and the market,” said Roger Ross, President, Via Licensing Corporation. “Via Licensing has had great success in developing audio licensing programs that are broadly adopted by the industry. For any patent pool, the goal is to create one-stop shopping for implementers of the applicable technology—with our MPEG-4 High Efficiency AAC and MPEG Surround patent pools, Via has resoundingly achieved that goal. Given the dramatic success of our audio programs and the fact that these technologies are the fundamental building blocks of the MPEG-H 3D Audio standard, this program is a natural fit for our existing licensors and licensees. Via Licensing looks forward to working with inventors and implementers of MPEG-H 3D Audio to build a single source for essential MPEG-H 3D Audio patents through an efficient, consolidated offering.”
Any entity that believes it has patents or pending patent applications that are essential to the normative portions of ISO/IEC 23008-3 (High Efficiency Coding and Media Delivery in Heterogeneous Environments, Part 3: 3D Audio) is invited to contact Via Licensing in order to receive information about how to submit patents for essentiality review.
For complete submission information, please email submissions@vialicensing.com, indicating your interest in submitting a patent or patent application to an independent patent evaluator for consideration of essentiality to the MPEG-H 3D Audio standard.
About Via Licensing Corporation
Via Licensing Corporation is dedicated to the development and administration of licensing programs for mandated, de facto, and emerging standards on behalf of innovative technology companies in the audio, broadcast, wireless, and automotive markets. For more information about Via Licensing Corporation, please visit vialicensing.com. Via Licensing Corporation is a wholly owned subsidiary of Dolby Laboratories, Inc., a company with more than 50 years of experience in technology licensing.
|
Related News
- Fraunhofer IIS licenses MPEG-H Audio patents to Samsung
- Fraunhofer IIS announces licensing program for the new MPEG-H 3D Audio Baseline Profile
- Fraunhofer IIS Licenses MPEG-H Audio Patents to LG Electronics
- MPEG LA Announces Call for Patents Essential to High Efficiency Video Coding (HEVC)
- Fraunhofer IIS partners with Avid to enable support of MPEG-H Audio in Pro Tools
Breaking News
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |