Dolphin Integration reveals advanced low-power solutions at the TSMC 2015 OIP Forum
Grenoble, France – September 7, 2015 - Dolphin Integration announces its participation to the TSMC Open Innovation Platform (OIP) Forum at the Santa Clara Convention Center, CA.
During the event Gilles Depeyrot, CEO of Dolphin Integration, will present a breakthrough low-power design methodology associated with a set of standardized Virtual Components of Silicon IP enabling to optimize low power networks in a SoC as well as associated modeling and simulation solutions.
« Our objective is to provide standardized building blocks for power, control and clock networks to simplify SoC integration by our customers while optimizing the overall power consumption. » stated Gilles Depeyrot.
As reducing power consumption is a real challenge, the presentation will deal with How to avoid blindness about power consumption during low-power SoC design?
- Selection of specific IPs for the always-on domain
- Implementation and control of power domains
- Optimization of a low power SoC during software development
- Construction of noise resilient subsystems
Attendees are also welcome to visit Dolphin Integration’s booth #312 in order to go further and discover the Silicon IP product portfolio.
For further information feel free to visit our website at www.dolphin-ip.com.
Want to book a meeting with one of our sales representative during TSMC 2015 OIP forum? Please contact us at lucile.denardo@dolphin.fr
About Dolphin Integration
Dolphin Integration contributes to "enabling mixed signal Systems-on-Chip" for worldwide customers - up to the major actors of the semiconductor industry - with Silicon IP components best at low-power consumption.
This wide offering is based on innovative libraries of standard cells, register files, memory generators and power regulators. Complete networks for power supply can be flexibly assembled together with their loads: from high-resolution converters for audio and measurement applications to power-optimized micro-controllers of 8 or 16 and 32 bits.
Over 30 years of diverse experiences in the integration of silicon IP components and providing services for ASIC/SoC design and fabrication, with its own EDA solutions solving unaddressed challenges, make Dolphin Integration a genuine one-stop shop covering all customers’ needs for specific requests.
The company striving to incessantly innovate for its customers’ success has led to two strong differentiators:
- state-of-the-art “configured subsystems” for high-performance applications securing the most competitive SoC architectural solutions,
- a team of Integration and Application Engineers supporting each user’s need for optimal application schematics, demonstrated through EDA solutions enabling early performance assessments
Its social responsibility has been from the start focused on the design of integrated circuits with low-power consumption, placing the company in the best position to now contribute to new applications for general power savings through the emergence of the Internet of Things.
|
Dolphin Semiconductor Hot IP
Related News
- Dolphin Integration receives TSMC's Open Innovation Platform 2015 Partner of the Year Award for Specialty IP
- Dolphin Integration and TSMC collaborate on Low-Power IoT Subsystem Design
- Low-power of Bluetooth SoCs depends on Dolphin Integration's oscillators
- Dolphin Integration launches a new Capless Regulator dedicated to low-power operation required by IoT applications
- Cadence to Demonstrate 10nm FinFET Design Solutions at TSMC 2015 OIP Ecosystem Forum
Breaking News
- JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
- BrainChip Gives the Edge to Search and Rescue Operations
- ASML targeted in latest round of US tariffs
- Andes Technology Celebrates 20 Years with New Logo and Headquarters Expansion
- Creonic Unveils Bold Rebrand to Drive Innovation in Communication Technologies
Most Popular
- Cadence to Acquire Arm Artisan Foundation IP Business
- AMD Achieves First TSMC N2 Product Silicon Milestone
- Why Do Hyperscalers Design Their Own CPUs?
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- New TSN-MACsec IP core for secure data transmission in 5G/6G communication networks
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |