ICE-IP-338 High-speed XTS-GCM Multi Stream Inline Cipher Engine
TSMC Wins All Apple's A10 Chip Business, Report Says
Peter Clarke, EETimes
9/14/2015 01:08 PM EDT
LONDON — TSMC will make all of the microprocessors for the iPhone 7 that is due to debut in 2016 using its 16nm FinFET manufacturing process, according to a Chinese language report.
Taiwan's Commercial Times referenced unnamed people in Apple's supply chain as sources for the story.
This would represent a rejection for Samsung and Globalfoundries – its partner in 14nm FinFET manufacturing. Samsung is thought to have a 50 percent share of production of the current processor, the A9 which is shipping in the recently launched iPhone 6 and iPhone 6 Plus. It would also be a bounce back into Apple's favor for TSMC.
E-mail This Article | Printer-Friendly Page |
|
Related News
Breaking News
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- YorChip announces patent-pending Universal PHY for Open Chiplets
- PQShield announces participation in NEDO program to implement post-quantum cryptography across Japan
Most Popular
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- Altera Launches New Partner Program to Accelerate FPGA Solutions Development
- Electronic System Design Industry Posts $5.1 Billion in Revenue in Q3 2024, ESD Alliance Reports
- Breaking Ground in Post-Quantum Cryptography Real World Implementation Security Research
- YorChip announces patent-pending Universal PHY for Open Chiplets