2.5D GPU / 2D & 3D Vector Graphics (OpenVG) Accelerator - D/AVE HD
TSMC Wins All Apple's A10 Chip Business, Report Says
Peter Clarke, EETimes
9/14/2015 01:08 PM EDT
LONDON — TSMC will make all of the microprocessors for the iPhone 7 that is due to debut in 2016 using its 16nm FinFET manufacturing process, according to a Chinese language report.
Taiwan's Commercial Times referenced unnamed people in Apple's supply chain as sources for the story.
This would represent a rejection for Samsung and Globalfoundries – its partner in 14nm FinFET manufacturing. Samsung is thought to have a 50 percent share of production of the current processor, the A9 which is shipping in the recently launched iPhone 6 and iPhone 6 Plus. It would also be a bounce back into Apple's favor for TSMC.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Related News
Breaking News
- JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
- BrainChip Gives the Edge to Search and Rescue Operations
- ASML targeted in latest round of US tariffs
- Andes Technology Celebrates 20 Years with New Logo and Headquarters Expansion
- Creonic Unveils Bold Rebrand to Drive Innovation in Communication Technologies
Most Popular
- Cadence to Acquire Arm Artisan Foundation IP Business
- AMD Achieves First TSMC N2 Product Silicon Milestone
- Why Do Hyperscalers Design Their Own CPUs?
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- New TSN-MACsec IP core for secure data transmission in 5G/6G communication networks