TSMC Discusses Next MEMS, Monolithic Mics
Peter Clarke, EETimes
9/22/2015 05:58 AM EDT
LONDON — To expand its role as a supplier to fabless MEMS vendors foundry TSMC plans to use its advantages in being able to combine CMOS logic and MEMS sensors together to come up with innovative sensors and use cases.
It plans to do this both through its capabilities in stacking and packaging multiple die and through monolithic integration, according to Kees Joosse, director of business development at TSMC Europe.
Joosse was speaking at the European MEMS Summit, organized by the SEMI trade association in Milan, September 17 and 18, and laid out the strengths in MEMS that TSMC wants to play to and the next platforms that TSMC will offer, MEMS microphones and gas sensors.
E-mail This Article | Printer-Friendly Page |
|
Related News
Breaking News
- Baya Systems Raises $36M+ to Propel AI and Chiplet Innovation
- Andes Technology D45-SE Processor Achieves ISO 26262 ASIL-D Certification for Functional Safety
- VeriSilicon and Innobase collaboratively launched second-generation Yunbao series 5G RedCap/4G LTE dual-mode modem IP
- ARM boost in $100bn Stargate data centre project
- MediaTek Adopts AI-Driven Cadence Virtuoso Studio and Spectre Simulation on NVIDIA Accelerated Computing Platform for 2nm Designs
Most Popular
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- Arm Chiplet System Architecture Makes New Strides in Accelerating the Evolution of Silicon
- InPsytech Announces Finalization of UCIe IP Design, Driving Breakthroughs in High-Speed Transmission Technology
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X