Moortec Semiconductor Announces New UMC 28nm HPC High Accuracy Embedded Temperature Sensor
October 20, 2015 --- Moortec Semiconductor Limited, provider of analog and mixed-signal IP solutions, announces its new High Accuracy Embedded Temperature Sensor targeting UMC’s advanced node 28nm HPC CMOS technology. This latest addition to the temperature sensor range extends Moortec's position as the leading provider of embedded thermal sensors and on-chip monitoring IP to semiconductor customers worldwide. The new UMC 28nm HPC Embedded Temperature Sensor is a high precision low power junction temperature sensor that has been developed to be embedded into ASIC designs.
Moortec Temperature Sensor on UMC 28nm HPC
On-chip Process, Voltage and Temperature (PVT) monitoring is becoming a key consideration for 40-nanometer (nm), 28-nm and FinFET technology–based designs. Higher accuracy monitors embedded within System on Chip (SoC) designs enable a greater opportunity for dynamic performance optimization, either for lower power or higher data throughput. Sensing die temperature, detecting logic speed and monitoring voltage supply levels can be used intelligently to vary system clock frequencies and the voltage levels of supply domains. A benefit of embedded thermal monitoring in particular is to enhance device reliability and life-time by assessing the electro migration effects of hot spots within the chip.
A key aspect is that PVT data collection can be applied to each and every device, either during production or 'in-the-field'. Moortec believe that strategies adopted by IC designers over the coming years will be heavily influenced through the analysis of such data harvested from in-chip monitors during the life time of every device.
"There is now a critical need for reliable and accurate on-chip thermal monitoring for semiconductor geometries of 28nm and below", said Managing Director Stephen Crosher. “Embedded PVT monitoring is an emerging market and we are pleased to be supporting UMC’s customers with our innovative thermal sensing circuit technology."
Moortec have extended their IP offering within the embedded monitoring space by providing PVT control subsystems, extra digital interfacing options (eg. AMBA APB) and Dynamic Voltage Frequency Scaling (DVFS) sub-systems.
About Moortec Semiconductor
Moortec Semiconductor, established in 2005, provide high quality analog and mixed-signal Intellectual Property (IP) solutions world-wide for a variety of applications. Having a track record of delivery to tier-1 semiconductor and product companies, Moortec provide a quick and efficient path to market for customer products and innovations. For information please visit www.moortec.com.
|
Related News
- Moortec Semiconductor Target Stacked DRAM Applications with its High Accuracy On-Chip Temperature Sensor
- Moortec Semiconductor Announces Industry Leading, High Accuracy On-Chip Temperature Sensor Range for Advanced Nodes
- MicroBT employs Moortec's 16nm Embedded Temperature Sensor in their HPC ASIC
- Analog Bits to Demonstrate Power Management and Embedded Clocking and High Accuracy Sensor IP at the TSMC 2024 Open Innovation Platform Ecosystem Forum
- Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |