Sequans Selects VeriSilicon ZSP Digital Signal Processor for LTE Cat0/Cat1 IoT and M2M Chipsets

ZSP architecture provides power efficient DSP solution for connectivity and enables fastest time-to-market

SANTA CLARA, Calif. & PARIS -- Oct 21, 2015 -- VeriSilicon Holdings Co., Ltd. (VeriSilicon) today announced that Sequans Communications (sequans - nyse:SQNS) has selected its Quad-MAC ZSP540 core for use with Sequans’s Calliope LTE chipset platform. The Calliope LTE chipset is a member of Sequans’s StreamliteLTE product line designed specifically for Machine to Machine (M2M) and Internet of Things (IoT) devices. Calliope has been certified by Verizon Wireless and recently won an IoT Innovations Award from Connected World Magazine as well as the Leading Lights 2015 Award for Most Innovative IoT/M2M Strategy from Light Reading.

Sequans, one of the most experienced pure-play 4G technology companies in the world, is a leading developer and supplier of cost and power efficient single-mode LTE chipset solutions. It has relied on VeriSilicon's ZSP Digital Signal Processor cores since 2006 to meet stringent power and board space requirements.

VeriSilicon is a Silicon Platform as a Service (SiPaaS™) company and semiconductor IP provider with many tier-one customers worldwide. More than 1 billion units based on VeriSilicon’s ZSP Cores have been shipped to date. The ZSP540 is a Quad-MAC DSP (Digital Signal Processor) core from the ZSP line of licensable DSP cores.

“LTE-enabled IoT is a significant market opportunity. In order to satisfy the stringent cost and power demands of our StreamliteLTE M2M and IoT products, we needed a DSP core that could scale easily and seamlessly,” said Bertrand Debray, chief operating officer of Sequans. “It was an easy choice to select VeriSilicon’s ZSP solution for our Calliope platform based on our long and successful history using the ZSP DSP cores in our StreamrichLTE feature-rich mobile computing products. We have been impressed with the ease of use and efficiency of the ZSP cores, as well as the strong support VeriSilicon provides to its customers. The ZSP solution has a clear advantage over competing DSP cores available in the market today.”

Also commenting on the announcement, Dr. Wayne Dai, Chairman, President and CEO of VeriSilicon stated, “We are pleased to partner with Sequans on these innovative and award winning solutions using VeriSilicon’s ZSP Digital Signal Processor. IoT devices using LTE Cat0/Cat1 connectivity represent a major growth market. A power and cost efficient solution like the Sequans Calliope platform is well positioned to lead this space. Our scalable ZSP architecture offers an ideal balance of performance, power efficiency and cost to meet the needs of M2M and IoT platforms. ZSP cores are also easy to use and ensure quick time-to-market with strong support and additional services available to our customers.”

About VeriSilicon

VeriSilicon Holdings Co., Ltd. is a Silicon Platform as a Service (SiPaaS™) company that provides IP-centric, platform based custom silicon solutions and end-to-end semiconductor turnkey services for a wide range of applications across a wide variety of end markets including mobile internet devices, datacenters, the Internet of Things (IoT), wearable electronics, smart homes, and automotive.

VeriSilicon’s silicon platforms include licensable ZSP® (digital signal processor) based HD audio, HD voice, multi-band and multi-mode wireless platforms, Hantro HD video platforms, wearable electronics platforms, IoT platforms, mixed signal NUI (natural user interface) platforms for voice, motion and touch interface. VeriSilicon’s custom silicon turnkey service encompasses design service that combines its technology solutions and value-added mixed signal IP portfolio targeted for a wide range of process technology nodes, including advanced nodes like 28nm, 22nm FD-SOI, FinFET and provide product engineering service for System on a Chip (SoC) as well as System in a Package (SiP).

VeriSilicon’s SiPaaS solutions shorten design cycle, enhance quality, and reduce risk. The breadth and flexibility of SiPaaS solutions make it an attractive alternative for a variety of customer types, including both emerging and established semiconductor companies, Original Equipment Manufacturers (OEMs), Original Design Manufacturers (ODMs), and large Internet platform companies.

Founded in 2001 and head-quartered in Shanghai, China, VeriSilicon has over 500 employees with six R&D centers (China, US and Finland) and nine sales offices worldwide. For more information about VeriSilicon, please visit www.verisilicon.com.

About Sequans Communications

Sequans Communications is a 4G chipmaker and leading provider of single-mode LTE chipset solutions to wireless device manufacturers worldwide. Founded in 2003, Sequans has developed and delivered six generations of 4G technology and its chips are certified and shipping in 4G networks, both LTE and WiMAX, around the world. Today, Sequans offers two LTE product lines: StreamrichLTE™, optimized for feature-rich mobile computing and home/portable router devices, and StreamliteLTE™, optimized for M2M devices and other connected devices for the Internet of Things. Sequans is based in Paris, France with additional offices in the United States, United Kingdom, Israel, Hong Kong, Singapore, Taiwan, South Korea, and China. For more information about Sequans, please visit www.sequans.com;

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