mCube Redefines MEMS Sensor Innovation by Unveiling the World's Smallest 1x1mm Accelerometer
SAN JOSE, CA – OCTOBER 28, 2015 – mCube, provider of the world’s smallest MEMS motion sensors, today announced the industry’s first 3-axis accelerometer which is less than a cubic millimeter in total size (0.9mm3). The MC3571 is only 1.1 x 1.1 x 0.74 mm in size making it 75% smaller than current 2 x 2mm accelerometers on the market today, enabling developers to design high-resolution 3-axis inertial solutions for products that require ultra-small sensor form factors.
The MC3571 features a Wafer Level Chip Scale Package (WLCSP), making it smaller than a grain of sand. This achievement marks a major innovation milestone in the MEMS sensor industry and opens up new design possibilities for the next generation of sleek new mobile phones, medical devices, and consumer products.
“The new MC3571 truly represents mCube’s vision of delivering a high-performance motion sensor in less than a cubic millimeter size,” said Ben Lee, president and CEO, mCube. “This advancement demonstrates how our monolithic technology can unleash amazing possibilities for designers to create exciting new products that could never be possible with today’s standard 2x2mm sensors.”
“Due to mCube’s unique monolithic MEMS design, it is the first company to produce a 1.1×1.1 MEMS accelerometer, the smallest size available on the market,” said Marwan Boustany, Senior Analyst for MEMS and Sensors in Mobile and Consumer Technology, IHS Technology. “IHS believes that mCube’s track record with its accelerometers, its continued technological development and the cost competitiveness associated with smaller silicon area have helped it to increase its market share in 2015.”
“mCube is the first company we’ve seen with a 1.1×1.1mm integrated MEMS+CMOS accelerometer and stretches once again the limits of miniaturization establishing new standards for the industry,” said Guillaume Girardin, Technology & Market Analyst MEMS & Sensors at Yole Développement (Yole). And his colleague, Thibault Buisson, Technology & Market Analyst, Advanced Packaging added: “Clearly, there is a growing trend among consumer companies to transition to wafer-level CSP packaging designs and with the MC3571 inertial motion sensor, mCube is at the forefront of this market evolution and at Yole, we are curious to see how competition will react.”
The high-resolution 14-bit, 3-axis MC3571 accelerometer is built upon the company’s award-winning 3D monolithic single-chip MEMS technology platform, which is widely adopted in mobile handsets with over 100 million units shipped. With the mCube approach, the MEMS sensors are fabricated directly on top of IC electronics in a standard CMOS fabrication facility. Advantages of this monolithic approach include smaller size, higher performance, lower cost, and the ability to integrate multiple sensors onto a single chip.
About the MC3571 Accelerometer
MC3571 is a low-noise, integrated digital output 3-axis accelerometer, which features the following:
- 8, 10, or 14-bit resolution;
- Output Data Rates (ODR) up to 1024Hz;
- Selectable interrupt modes via an I2C bus;
- Requires only a single external passive component, compared to competitive offerings requiring 2 or more.
Samples of the world’s smallest 1.1×1.1mm WLCSP accelerometer are available to select lead customers now with volume production scheduled for the second quarter of 2016.
Supporting Resources:
- mCube Company Fact Sheet
- MC3571 Datasheet
- Whitepaper: Advantages of Integrated MEMS to Enable the Internet of Moving Things
- Media Resources: photos, logos, bios
- mCube Website
About mCube
mCube makes the smallest motion sensors in the world. As a technology leader, mCube aspires to be the enabler for the Internet of Moving Things by putting a MEMS motion sensor on anything that moves, improving the way consumers live and interact with technology. mCube is backed by leading investors and has already shipped over 100M units. For more information, visit www.mcubemems.com. Follow mCube on Twitter @mcubemems
|
Related News
- Prophesee launches the world's smallest and most power-efficient event-based vision sensor, bringing more intelligence, privacy and safety than ever to consumer Edge-AI devices
- Analog Bits to Demonstrate Automotive Grade IP's Including a Novel High Accuracy Sensor at TSMC 2023 North America Open Innovation Platform Ecosystem Forum
- Exclusive deal leads to world's smallest sensor for LED lighting & IoT
- MEMSensing Launches the World's Smallest Commercial 3-Axis Accelerometer MSA330 with SMIC
- Medigus and Tower Semiconductor Announce World's Smallest Medical Video Camera Based on Advanced CMOS Image Sensor
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |