Scope, Not Scale, Drives Freescale/NXP Nuptials
Junko Yoshida, EETimes
12/7/2015 08:42 PM EST
AUSTIN, Tex. — As NXP Semiconductors and Freescale Semiconductor officially completed a blockbuster merger Monday (Dec. 7), NXP CEO Rick Clemmer declined to answer an EE Times question about the number of layoffs likely to ensue. The CEO said he won’t yet know absolute numbers for a few months.
Both Clemmer and Jeff Palmer, vice president of Investor Relations, NXP, added that the jobs affected will be mostly in support functions, rather than engineering teams. “You don’t need two Investor Relations guys, or two sets of board of directors,” Palmer explained. Palmer also added, “R&D programs and key customer-facing programs won’t be cut.”
E-mail This Article | Printer-Friendly Page |
|
NXP Hot IP
Related News
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards