Multi-Video-Source Multiplexing Serial Video Transmitter for MIPI CSI2
Fab Equipment Spending: Look for Upward Swing into 2016
SAN JOSE, Calif. ─ December 8, 2015 ─ Worldwide semiconductor fab equipment capital expenditure growth (new and used) for 2015 is expected to be 0.5 percent (total capex of US$35.8 billion), increasing another 2.6 percent (to a total of $36.7 billion) in 2016, according to the latest update of the quarterly SEMI World Fab Forecast report.
SEMI reports that in 2015, Korea outspent all other countries ($9.0 billion) on front-end semiconductor fab equipment, and is expected to drop to second place in 2016 as Taiwan takes over with the largest capex spending at $8.3 billion. In 2015, Americas ranked third in overall regional capex spending with about $5.6 billion and is forecast to increase only slightly to (5.1 percent) in 2016.
In 2015, 80 to 90 percent of fab equipment spending went to 300mm fabs, while only 10 percent was for 200mm or smaller. SEMI’s recently published “Global 200mm Fab Outlook” provides more detail about past and future 200mm activities.
Examining fab equipment spending by product type, Memory accounts for the largest share in 2015 and 2016. While 2015’s spending was dominated by DRAM, the SEMI World Fab Forecast reports that 2016 will be dominated by Flash, mainly 3D-related architectures. Capacity for 3D-NAND will continue to surge. SEMI’s report tracks 10 major 3D producing facilities, with a capacity expansion of 47 percent in 2015 and 86 percent in 2016.
The Foundry segment is next in terms of the largest share of fab equipment spending in 2015 and 2016. In general, the foundry segment shows steadier, more predictable spending patterns than other device product segments. Coming in third place in fab equipment spending, MPU had lower spending in 2015. Logic spending was very strong in 2015, with 90 percent growth, driven by SONY’s CMOS image sensors.
Throughout 2015, SEMI anticipates that there will be 1,167 facilities worldwide investing in semiconductor equipment in 2016, including 56 future facilities across industry segments from Analog, Power, Logic, MPU, Memory, and Foundry to MEMS and LEDs facilities. For further details, please reference to the latest edition of SEMI’s World Fab Forecast report.
Learn more about the SEMI World Fab Forecast: www.semi.org/MarketInfo/FabDatabase and www.youtube.com/user/SEMImktstats
About SEMI
SEMI is the global industry association serving the electronics manufacturing supply chains. Our more than 2,000 member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org
|
Related News
- Equipment Spending Slows but Still Positive in 2015 and 2016
- Strong Fab Equipment Spending Expected in 2015; Slowing but Positive 2016
- 300mm Fab Equipment Spending Forecast to Reach Record $137 Billion in 2027, SEMI Reports
- 2024 Global Fab Equipment Spending Recovery Expected After 2023 Slowdown, SEMI Reports
- Global 300mm Fab Equipment Spending Forecast to Reach Record $119 Billion in 2026, SEMI Reports
Breaking News
- Baya Systems Raises $36M+ to Propel AI and Chiplet Innovation
- Andes Technology D45-SE Processor Achieves ISO 26262 ASIL-D Certification for Functional Safety
- VeriSilicon and Innobase collaboratively launched second-generation Yunbao series 5G RedCap/4G LTE dual-mode modem IP
- ARM boost in $100bn Stargate data centre project
- MediaTek Adopts AI-Driven Cadence Virtuoso Studio and Spectre Simulation on NVIDIA Accelerated Computing Platform for 2nm Designs
Most Popular
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- Arm Chiplet System Architecture Makes New Strides in Accelerating the Evolution of Silicon
- InPsytech Announces Finalization of UCIe IP Design, Driving Breakthroughs in High-Speed Transmission Technology
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
E-mail This Article | Printer-Friendly Page |