CEVA-XM4 Imaging and Vision DSP Named "Best Processor IP of 2015" by The Linley Group
CEVA-XM4 enables embedded systems to perform deep learning tasks 3X faster than the leading GPU-based systems while consuming 30X less power.
MOUNTAIN VIEW, Calif. -- Jan. 19, 2016 -- CEVA, Inc. (NASDAQ: CEVA), today announced that its fourth generation imaging and vision DSP, the CEVA-XM4 intelligent vision processor, has been named "Best Processor IP of 2015" by semiconductor industry technology analyst, The Linley Group.
Linley's "Best Processor IP" category covers a broad range of licensable processor cores including CPUs, DSPs, GPUs, VPUs and NoCs. The winner is chosen by the organization's team of technology analysts for the product they consider to be superior in performance, power efficiency, and die area for the intended application.
In selecting the CEVA-XM4 as this year's winner, the Linley Group noted: "We estimate that the CEVA-XM4 can deliver more integer performance than any other licensable VPU (Vision Processing Unit). As a result, the XM4 can run the same convolutional-neural-network (CNN) object-recognition models that computer-vision researchers developed using Nvidia's Cuda parallel-computing platform but at a fraction of the power and cost."
"We are delighted to name the CEVA-XM4 vision processor the 'Best Processor IP of 2015', reflecting its superior capabilities for enabling computer vision in embedded devices," noted Linley Gwennap, principal analyst at The Linley Group. "As computer vision becomes increasingly commonplace across the automotive, consumer, and industrial markets, the CEVA-XM4 offers a compelling solution to bring these capabilities to cost- and power-sensitive applications."
"The CEVA-XM4 has rapidly emulated the success of its predecessor, the CEVA-MM3101 since its launch in February 2015 and this award from The Linley Group is a fantastic endorsement of this exceptional technology," said Eran Briman, vice president of marketing and corporate development at CEVA. "With more than twenty imaging and vision design wins to date, spanning drones, ADAS, surveillance, smartphones, action cameras and DSLR cameras, we are enabling our customers to achieve their goal of integrating high-performance and differentiated computer vision capabilities in any end device."
CEVA's imaging and vision DSPs addresses the extreme processing requirements of the most sophisticated computational photography and computer vision applications such as video analytics, augmented reality and advanced driver assistance systems (ADAS). By offloading these performance-intensive tasks from the CPUs and GPUs, the highly-efficient DSP dramatically reduces the power consumption of the overall system, while providing complete flexibility. The platform includes a vector processor developed specifically to deal with the complexities of such applications and an extensive Application Development Kit (ADK) to enable easy development environment. The CEVA ADK includes an Android Multimedia Framework (AMF) that streamlines software development and integration effort, a set of advanced software development tools and a range of software products and libraries optimized for the DSP. CEVA also provides its ADAS customers with an ISO 26262 Compliant Safety Design Package for the CEVA-XM4, which serves to accelerate the ASIL certification process for their CEVA-XM4 based designs. For more information, visit http://www.ceva-dsp.com/CEVA-XM-Family.
Deep Learning Webinar
To learn more about the CEVA-XM4, and the benefits of using it to implement deep learning in low power embedded systems, view the on-demand webinar at http://bit.ly/1hoam9p
About CEVA, Inc.
CEVA is the leading licensor of cellular, multimedia and connectivity technologies to semiconductor companies and OEMs serving the mobile, consumer, automotive and IoT markets. Our DSP IP portfolio includes comprehensive platforms for multimode 2G/3G/LTE/LTE-A baseband processing in terminals and infrastructure, computer vision and computational photography for any camera-enabled device, audio/voice/speech and ultra-low power always-on/sensing applications for multiple IoT markets. For connectivity, we offer the industry's most widely adopted IPs for Bluetooth (Smart and Smart Ready), Wi-Fi (802.11 b/g/n/ac up to 4x4) and serial storage (SATA and SAS). One in every three phones sold worldwide is powered by CEVA, from many of the world's leading OEMs including Samsung, Huawei, Xiaomi, Lenovo, HTC, LG, Coolpad, ZTE, Micromax and Meizu. Visit us at www.ceva-dsp.com
|
Ceva, Inc. Hot IP
Related News
- Arm Mali-G77 GPU named Best Processor IP in The Linley Group's Analysts' Choice Awards
- Novatek Licenses CEVA-XM4 Imaging and Vision DSP for Embedded Visual Intelligence
- CEVA and LG Partner to Bring Intelligent Vision Processing to Smart Home Appliances
- Synopsys' ARC SEM Security Processors Win Linley Group's 2016 Analysts' Choice Award for Best Processor IP
- DeepGlint Harness the Power of CEVA-XM4 Imaging and Vision Platform for Intelligent Video Analytic and ADAS Solutions
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |