Telink Semiconductor Launches World's First All-in-One System-on-Chip for the Internet of Things

SHANGHAI-- January 19, 2016 -- Telink Semiconductor, a fabless integrated circuit design company focused on the Internet of Things (IoT), today launched the TLSR8269, the world’s first all-in-one System-on-Chip (SoC) for the Internet of Things. A multi-mode SoC that is the latest addition to Telink’s broad range of low power wireless chips, the TLSR8269 redefines the IoT landscape by combining the features and functions needed for all 2.4GHz IoT standards into a single SoC.

Telink’s proprietary BLE Mesh technology already is the leading solution for smart lighting, smart home and related applications and has been adopted by Tier One lighting customers in US and China. With the ability to integrate security, voice search, touch control and other factors, the TLSR8269 is an ideal single-chip solution for human interface devices ranging from smart home applications to wireless toys.

“The TLSR8269 concurrent multi-standard support is the culmination of years of R&D by Telink’s leadership engineering team,” said Dr. Wenjun Sheng, CEO of Telink Semiconductor. “It will change the face of IoT, enabling end products to be built with a single chip that rules all standards.”

The TLSR8269 combines the radio frequency (RF), digital processing, protocols stack software and profiles for Bluetooth Smart, BLE Mesh, 6LoWPAN, Thread, Zigbee, RF4CE, HomeKit and 2.4GHz proprietary standard support in a single SoC. The TLSR8269’s 512KB FLASH enables all functionality to be embedded in every chip, and the final end product functionality is configurable via software, providing ultimate flexibility. The TLSR8269 can even support OTA upgrades, product feature roll outs and upgrades.

For some use cases, the TLSR8269 can “concurrently” run two standards — for example, Bluetooth Smart and ZigBee/RF4CE — enabling products to bridge the smartphone and home automation world with a single chip and no requirement for an external hub.

Security is critical for IoT applications, and the TLSR8269 integrates hardware acceleration to support the complicated security operations required by HomeKit, Thread and other standards without the requirement for an external DSP, thereby significantly reducing the equipment eBOM.

The TLSR8269 supports analog and digital microphones and audio output with enhanced voice performance for voice search and other such applications. The TLSR8269 also includes a full range of on-chip peripherals for interfacing with external components such as LEDs, sensors, touch controllers, keyboards, and motors. This makes it an ideal single-chip solution for IoT and human interface devices such as smart lighting, smart home devices, advanced remote controls, and wireless toys.

For further information on the TLSR8269 chip and other Telink products, please contact Telink at telinksales@telink-semi.com.

About Telink

Telink Semiconductor Co. Ltd., a fabless IC design company, develops highly integrated low power radio-frequency and mixed signal system chips for Internet of Things (IoT) applications. Its product portfolio includes low-power 2.4Ghz RF SoCs for Bluetooth Smart, Zigbee, 6LoWPAN/Thread, Homekit and low-power high-precision analog ICs for resistive/capacitive/electromagnetic touch control, serving numerous markets including smart lighting, home automation, smart city, and other consumer electronics. Its investors include Intel Capital. For more information, please visit www.telink-semi.com.

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