SAN JOSE, Calif. –September 9, 2002 –Palmchip Corporation, a pioneer in system-on-chip (SoC) platform solutions, today announced that Proxim Corporation (Nasdaq: PROX), a leading provider of high-performance wireless local area networking (WLAN) and wireless wide area networking (WWAN) products, has licensed the company's new PalmPak2TM (DP1800) SoC platform for their wireless networking infrastructure products featuring data throughput of 100 Mbps and higher. The PalmPak platform, integrating two MIPS processor cores, also will enable new Proxim products to operate with extended range in both indoor and outdoor wireless applications.
The PalmPak2 platform that Proxim has licensed contains a standard set of SoC peripherals, including a system timer, a watchdog timer, an interrupt controller, programmable I/O and an alphanumeric LCD interface. It also includes a high-bandwidth memory controller, which supports Flash, SRAM, SDRAM or DDR depending on the user's requirements. The user also has the option to select from a library of cores and subsystems that have been pre-integrated and verified to work in this platform, including an IDE Host, 10/100 Ethernet MAC, USB 1.1 and 2.0 Host, PCI, PCMCIA Host, I2C Host, 16550 UART, and master/slave SPI. Other custom cores and subsystems can be easily integrated into this platform, such as MPEG decoders, Gigabit Ethernet MACs, and 802.11a, 802.11b or 802.16 wireless MACs.
"Proxim chose Palmchip's PalmPak2 platform because its versatility and ease-of-use enables a dramatic reduction in system-on-chip design time," said Kevin J. Negus, chief technology officer for Proxim. "By implementing this complete platform, we are able to increase design productivity and more quickly deliver the high-performance solutions that our customers demand."
"Our platform technology enables companies like Proxim to leverage their design efforts over a wide range of products," said Jauher Zaidi, CEO at Palmchip. "With chip designs becoming more and more complex, customers need the comprehensive set of SoC peripherals and the library of cores and subsystems that the PalmPak platform provides as the only way to meet tight market windows and tough cost targets. "
About PalmPak2
The DP1800 PalmPak2 is a CoreFrame® -based configurable SoC platform that contains all the peripheral functions required for a basic SoC with options to select from a suite of library components that has been ported to this platform. PalmPak2 currently supports MIPS4K series, ARC, ARM7TDMI, and ARM9TDMI embedded processor cores. The CoreFrame® architecture is inherently processor independent, allowing other processors to be easily integrated, including PowerPC, and Tensilica. The platform also can be used as a companion chip for high performance standalone processors, such as the Strong ARM SA1100, and PMC-Sierra RM7000 processors.
About Proxim
Proxim Corporation is a leading provider of high-performance wireless local area networking (WLAN) and wireless wide area networking (WWAN) products. The company holds leading shares in the fast-growing markets for 802.11b, 802.11a, and license-exempt fixed wireless networking systems. Proxim's systems securely connect networks within buildings as well as between locations up to 40 miles apart, providing enterprises, service providers, and consumers with unprecedented networking capacity and mobility. Proxim Corporation was created by the merger between Proxim, Inc. and Western Multiplex Corporation in March, 2002. The company's website is www.proxim.com.
About Palmchip
Palmchip Corporation develops and licenses configurable SoC platforms, subsystems, and IP cores for embedded SoC's used in networking and storage connectivity applications. Palmchip's IP is based on its CoreFrame® integration architecture. This technology is independent of processor, I/O or foundry, allowing designers flexibility in porting IP from any number of sources. Palmchip was established in 1996 and is today a privately held company based in San Jose, California (USA). More information can be obtained at www.palmchip.com.
PalmPak2TM, Palmchip, CoreFrame®, and the palm leaf logo are registered trademarks. All other trademarks are the property of their respective owners.
PROXIM'S FORWARD-LOOKING STATEMENTS
This press release includes forward-looking information about Proxim and statements that are subject to risks and uncertainties that could cause actual results to differ materially. These statements are often identified by words such as "expect," "anticipate" and "intend." Statements regarding the expected benefits of Proxim's licensing of Palmchip's PalmPak2 platform are forward looking statements and subject to risks and uncertainties, including risks that products will not perform as anticipated and design times and productivity will not be improved. For risks about Proxim Corporation's business, see Proxim Corporation's Form 10-Qs filed on August 12, 2002, as amended, and May 13, 2002, and subsequent Forms 8-K, as well as Western Multiplex's registration statement on Form S-4 filed on February 25, 2002, its Form 10-K for the year-ended December 31, 2001 and subsequent Forms 8-K, Proxim, Inc.'s Form 10-K for the year-ended December 31, 2001 and subsequent Forms 8-K, and other SEC filings.
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