LSI Logic first with Serial ATA 1.0 ASIC implementation - expands high-speed interface portfolio
- LSI Logic Serial ATA 1.0 Link & Transport core and 1.5 gigabit-per-second Serial ATA 1.0 Physical Layer core now available for easy integration into an ASIC
- Serial ATA Working Group expects Serial ATA 1.0 to be the evolutionary replacement for the Parallel ATA interface
MILPITAS, Calif., September 9, 2002 – At the Intel Developers Forum (IDF) today, LSI Logic Corporation announced it is the first semiconductor company to offer an ASIC implementation of the Serial ATA 1.0 high-speed interface technology with the introduction of two new cores. Both the LSI Logic Serial ATA 1.0 Link & Transport core and the 1.5Gbs Serial ATA 1.0 Physical Layer (PHY) core are now available to customers for easy integration into an ASIC.
Processed in the LSI Logic Gflx™ 0.11-micron technology, these fundamental building blocks can be used along with the company's extensive CoreWare® library of robust intellectual property (IP). The LSI Logic Serial ATA Link & Transport and PHY technologies comply with the Serial ATA 1.0 specification approved by the Serial ATA Working Group in mid-August 2001. The Working Group expects the Serial ATA 1.0 specification to be widely adopted next year in disk drive, host bus adapter and computer chip-set products as the evolutionary replacement of the Parallel ATA interface.
LSI Logic Link & Transport technology is available as a "synthesizeable," Register Transfer Level (RTL) core and was demonstrated in Seagate's Serial ATA hard disk drive technology at IDF in Spring 2002. The 1.5 Gbs Serial ATA PHY, also demonstrated at IDF Spring 2002, uses the widely adopted LSI Logic GigaBlaze® serial transceiver core, which also supports Fibre Channel, Serial Attached SCSI, Gigabit Ethernet, PCI Express and InfiniBand transceiver standards. Both technologies are available for integration into device-side and host-side ASIC solutions, eliminating the need for and cost of additional devices to bridge to Serial ATA from legacy interfaces.
"More than ever, storage customers are challenged with developing products that support a broad range of storage interfaces under increased time-to-market pressures. LSI Logic recognizes these challenges and, through its investments in high speed interface technologies, has become a world leader in this field," said David Jones, vice president and general manager of the LSI Logic Storage and Computing ASIC Division. "Our customers will be able to reduce their time-to-market using our proven Serial ATA IP offerings, while also benefiting from the reduced investment necessary to support Serial ATA in their peripheral or host products."
Supporting the LSI Logic Serial ATA IP offerings, the LSI Logic Gflx technology, a 0.11-micron drawn gate (0.08-micron Leff) process, provides unprecedented flexibility. Gflx offers seven different product modules, including high performance and low leakage transistors, performance and density libraries, mixed signal capability, application optimized I/O sets, metal options ranging from five to nine layers and a broad selection of memory compilers, to meet a multitude of customer and market requirements.
About LSI Logic Corporation
LSI Logic Corporation (NYSE: LSI) is a leading designer and manufacturer of communications, consumer and storage semiconductors for applications that access, interconnect and store data, voice and video. In addition, the company supplies storage network solutions for the enterprise. LSI Logic is headquartered at 1621 Barber Lane, Milpitas, CA 95035, http://www.lsilogic.com.
|
Related News
- LSI Logic Simplifies High-Speed Serial Interface Design with Expanded Rapidchip Xtreme Family of Platform ASICs
- LSI Logic extends leadership in high-speed serial interconnect with two GigaBlaze 0.11-micron multi-gigabit transceiver cores
- Kawasaki Microelectronics Partners with CEVA To Add Fully Compliant 1.5Gbps Serial ATA Macro to its 0.13 um ASIC IP Portfolio
- LSI Logic Hypertransport physical interface core power high-speed data transfer rates
- LSI Logic DDR interface core delivers up to 400Mb/s for high-speed DDR SDRAM applications
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |