CEVA Powers DSP Group's Next-Generation Ultra-Low-Power Always-On Voice Processor
DSP Group deploys CEVA ultra-low-power DSP for audio, voice and always-on functionality in DBMD4 platform targeting mobile wearables and IoT
BARCELONA, Spain, Feb. 24, 2016 -- Mobile World Congress -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing IP for smarter, connected devices, and DSP Group®, Inc., a leading global provider of wireless chipset solutions for converged communications, today announced that DBMD4 – DSP Group's next-generation, ultra-low-power, always-on voice and audio processor is powered by CEVA's audio/voice/sensing DSP.
Adoption of voice-enabled applications such as smart assistants, voice commands and voice search is proliferating in mobile, smartwatches and IoT devices. The CEVA-powered DBMD4 allows battery-operated devices to actively listen and sense voice activity and commands while in ultra-low power mode - alleviating battery strain, improving device usability and extending battery life.
"Voice and audio are playing an increasingly important role in how we interact with our personal devices in a more intelligent way," said Ofer Elyakim, CEO of DSP Group. "CEVA's audio/voice/sensing DSP is at the foundation of our DBMD4 Always On Voice processor, delivering the desired power and processing efficiency to drive the industry's lowest power 'always-on' solution, in addition to the performance required to handle advanced noise cancellation algorithms."
"We are pleased to extend our partnership with DSP Group as they enhance their always-on voice activation product line with new features and even better performance," said Eran Briman, vice president of marketing at CEVA. "DBMD4 offers a compelling solution for any wearable, mobile or consumer device looking to add a voice-enabled interface that is highly accurate even in high noise environments."
About DSP Group
DSP Group®, Inc. (NASDAQ: DSPG) is a leading global provider of wireless chipset solutions for converged communications. Delivering semiconductor system solutions with software and hardware reference designs, DSP Group enables OEMs/ODMs, consumer electronics (CE) manufacturers and service providers to cost-effectively develop new revenue-generating products with fast time to market. At the forefront of semiconductor innovation and operational excellence for over two decades, DSP Group provides a broad portfolio of wireless chipsets integrating DECT/CAT-iq, ULE, Wi-Fi, PSTN, HDClear™, video and VoIP technologies. DSP Group enables converged voice, audio, video and data connectivity across diverse mobile, consumer and enterprise products – from mobile devices, connected multimedia screens, and home automation & security to cordless phones, VoIP systems, and home gateways. Leveraging industry-leading experience and expertise, DSP Group partners with CE manufacturers and service providers to shape the future of converged communications at home, office and on the go. For more information, visit www.dspg.com.
About CEVA, Inc.
CEVA is the leading licensor of signal processing IP for a smarter, connected world. We partner with semiconductor companies and OEMs worldwide to create power-efficient, intelligent and connected devices for a range of end markets, including mobile, consumer, automotive, industrial and IoT. Our ultra-low-power IPs for vision, audio, communications and connectivity include comprehensive DSP-based platforms for LTE/LTE-A/5G baseband processing in handsets, infrastructure and machine-to-machine devices, computer vision and computational photography for any camera-enabled device, audio/voice/speech and ultra-low power always-on/sensing applications for multiple IoT markets. For connectivity, we offer the industry's most widely adopted IPs for Bluetooth (Smart and Smart Ready), Wi-Fi (802.11 b/g/n/ac up to 4x4) and serial storage (SATA and SAS). Visit us at www.ceva-dsp.com
|
Ceva, Inc. Hot IP
Related News
- Hisense Selects Synaptics' DBM10L Processor For First AI-Enabled Always-On Voice Remote Control
- CEVA's High-Performance DSP Solution to Power Renesas' Next-Generation Automotive SoC
- Maxim's Dynamic Speaker Management Technology Running on the CEVA-TeakLite-4 Ultra-Low-Power DSP Provides the Ultimate Sound Experience from Micro Speakers
- CEVA's Bluetooth 5 Low Energy IP Powers ON Semiconductor's Ultra-Low-Power Radio SoC for IoT and Connected Health and Wellness Devices
- Realtek Licenses Cadence Tensilica Fusion DSP to Support Ultra-Low-Power Always-On Functions in the RTS3110/RTS3111 Context Hub Chip
Breaking News
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |