TSMC April 2016 Revenue Report
Hsinchu, Taiwan, R.O.C. – May 10, 2016 - TSMC (TWSE: 2330, NYSE: TSM) today announced its net revenues for April 2016: On a consolidated basis, revenues for April 2016 were approximately NT$66.84 billion, a decrease of 8.5 percent from March 2016 and a decrease of 11.3 percent from April 2015. Revenues for January through April 2016 totaled NT$270.34 billion, a decrease of 9.1 percent compared to the same period in 2015.
TSMC reiterates its second quarter 2016 revenue guidance of NT$215 billion to NT$218 billion.
TSMC April Revenue Report (Consolidated):
Period | Net Revenues |
April 2016 | 66,843 |
March 2016 | 73,089 |
M-o-M Increase (Decrease) % | (8.5) |
April 2015 | 75,330 |
Y-o-Y Increase (Decrease) % | (11.3) |
January to April 2016 | 270,339 |
January to April 2015 | 297,364 |
Y-o-Y Increase (Decrease) % | (9.1) |
|
Related News
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |