ARM Announces POP IP for ARM Cortex-A73 on TSMC 16FFC Process
Cambridge, UK -- June 8, 2016 - ARM today announced the availability of ARM® Artisan® physical IP, including POP™ IP, for mainstream mobile SoCs based on the new ARM Cortex®-A73 processor on the TSMC 16FFC (FinFET Compact) process. The third-generation Artisan FinFET platform is optimized for TSMC 16FFC process and will enable ARM SoC partners to design the most power-efficient, high performance implementations of Cortex-A73 for mobile and other consumer applications for mass-market price points.
ARM taped out the first TSMC 16FFC test chip incorporating Cortex-A73 POP IP in early May 2016. The chip is enabling ARM partners to move quickly towards the validation of key performance and power metrics for their new products. The Cortex-A73 is part of the latest ARM mobile IP suite and it has been designed to deliver significant increases in sustained performance and efficiency compared with the Cortex-A72.
"When designing mainstream mobile SoCs, design teams are challenged to balance implementation and optimization efforts with cost-efficiencies," said Will Abbey, general manager, physical design group, ARM. "Our latest physical IP collaboration with TSMC addresses this challenge by providing ARM partners with the best SoC optimization solution available for the Cortex-A73. An optimized Cortex-A73 POP solution will help our partners to accelerate their own core implementation knowledge and enable faster time to tape out."
"Our collaboration with ARM continues to drive advanced technologies across many sectors, including mobile," said Suk Lee, Senior Director, Design Infrastructure Marketing Division, TSMC. "Customers designing their next-generation flagship mobile SoCs will benefit from this new highly efficient solution, enabling them to deliver the highest performance Cortex implementations and bring innovative new products to market quicker."
Mutual ARM and TSMC silicon partners have also benefitted from early access to ARM Artisan physical IP and 16nm FinFET+ tape-outs of the Cortex-A72 processor, the high-performance processor powering many of today's best-selling primary compute devices. The Artisan 16FFC physical IP platform is currently available for evaluation on the updated DesignStart portal, which gives access to a broad range of Artisan physical IP at http://designstart.arm.com.
More about the ARM and TSMC Collaboration
- ARM Drives the Future of Premium Mobile Computing with a Multicore Test Chip based on 10FinFET from TSMC (May 2016)
- ARM and TSMC Announce Multi-Year Agreement to Collaborate on 7nm FinFET Process Technology for High-Performance Compute (March 2016)
- ARM and TSMC Unveil Roadmap for 64-bit ARM-based Processors on 10FinFET Process Technology (October 2014)
- TSMC and ARM set new Benchmarks for Performance and Power Efficiency with First Announced FinFET Silicon with 64-bit ARM big.LITTLE Technology (September 2014)
- ARM and TSMC Tape Out First ARM Cortex-A57 Processor (April 2013)
About ARM
ARM (LSE: ARM, NASDAQ: ARMH) designs technology at the heart of the world's most advanced digital products. We are enabling the development of new markets and transformation of industries and society, invisibly creating opportunity for a globally connected population. Our scalable, energy-efficient processor designs and related technologies deliver intelligence wherever computing happens, ranging from sensors to servers, including smartphones, tablets, digital TVs, enterprise infrastructure and the Internet of Things.
Our innovative technology is licensed by ARM Partners who have shipped more than 86 billion System on Chip (SoCs) containing our intellectual property. Together with our Connected Community, we are breaking down barriers to innovation for developers, designers and engineers, ensuring a fast, reliable route to market for leading electronics companies. Learn more and join the conversation at http://community.arm.com.
|
Arm Ltd Hot IP
Related News
- Moortec Provide Embedded Monitoring Solutions for Arm's Neoverse N1 System Development Platform on TSMC 7nm Process Technology
- Cadence LPDDR4/4X Memory IP Subsystem Achieves ISO 26262 ASIL C Certification from SGS-TUV Saar Using TSMC 16FFC Process Technology
- Arm, Cadence and Xilinx Introduce First Arm Neoverse System Development Platform for Next-Generation Cloud-to-Edge Infrastructure, Implemented on TSMC 7nm Process Technology
- Xilinx, Arm, Cadence, and TSMC Announce World's First CCIX Silicon Demonstration Vehicle in 7nm Process Technology
- eMemory Qualified NeoFuse in TSMC 16FFC Process
Breaking News
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |