Mobiveil successfully completes RapidIO 3.1 IP (GRIO) interoperability testing with IDT's next generation RXS 50Gbps RapidIO switch
IDT® Mobiveil interoperability to enable the RapidIO 3.1 ecosystem; Mobiveil’s RapidIO Controller Enables SoC, ASIC, and FPGA Designers to Build RapidIO 10xN (Gen 3) 40Gbps End Points to Feed IDT RXS 50Gbps switches
MILPITAS, CA - June 23, 2016 — Mobiveil, Inc. a fast growing supplier of silicon intellectual property (SIP), platforms and IP-enabled design services, today announced that its RapidIO Controller (GRIO) End-Point IP has successfully completed pre-silicon interoperability tests with Integrated Device Technology’s (IDT®) next-generation RapidIO switches. The emerging IoT, wearables, and virtual/augmented reality technologies will demand 5G broadband speed. This will fuel new SoC, ASIC, and FPGA designs for wireless network end points operating at the RapidIO 10xN 50Gbps data rates. Mobiveil’s RapidIO Controller (GRIO) End-Point IP assures designers their chips are compliant to RapidIO 10xN Specifications revision 3.1 and will operate seamlessly with the IDT RapidIO switches.
“We launched our 50Gbps switches early this year to deliver the ultra-low latency, high bandwidth and superior energy efficiency for development of 4G LTE Advanced (LTE-A) and 5G wireless infrastructure systems,” said Sean Fan, vice president and general manager of Computing & Communications Division at IDT of San Jose, Calif. “The 10xN RapidIO switches target mobile infrastructure (base stations, C-RAN, mobile-edge compute); data center (data analytics, high-performance computing); aerospace, industrial control and defense. The new switches can increase existing systems’ aggregate backplane bandwidth and will offer designers and architects a compelling solution for future 5G systems. Mobiveil’s IP provides designers a shorter time to market and assurance their designs will seamlessly work with our switches.”
“We are thrilled to provide SoC, ASIC, and FPGA designers compliant RapidIO 3.1 Controller End-Point IP,” said Ravi Thummarukudy, CEO of Mobiveil Inc. “IDT is a leader in the deployment of RapidIO switch solutions and their latest offering reinforces that role. Our RapidIO 10xN controller IP seamlessly integrating with the 50G switches leverages our strong partnership. Our GRIO IP optimizes link utilization, latency, reliability, power consumption in a compact silicon footprint to serve wireless infrastructure, aerospace, industrial control and server requirements. In addition to the Generic RapidIO controller (GRIO) we also provide a sophisticated AXI bridge for easy integration into customers’ SOC.”
The Market Opportunity
According to market research firm SNS Research of Dubai, UAE, “the wireless network infrastructure market is currently in a phase of transition that is bringing new challenges and opportunities to infrastructure vendors. Mobile operators are expected to significantly increase their spending in the evolving HetNet (Heterogeneous Network) submarket, which encompasses small cells, carrier Wi-Fi, DAS (Distributed Antenna Systems) and C-RAN (Centralized RAN) infrastructure. Small cell and carrier Wi-Fi equipment alone will represent a market worth $3 Billion in 2016. Supplemented further by DAS and C-RAN investments, the HetNet sector is attracting considerable attention from both established vendors as well as startups that solely focus on this submarket.
About Mobiveil
Mobiveil is a fast?growing technology company that specializes in development of Silicon Intellectual Properties, platforms, and solutions for the Storage, Networking and IoT markets. The Mobiveil team leverages decades of experience in delivering high?quality, production?proven, and high-speed serial interconnect Silicon IP cores and custom and standard form factor hardware boards to leading customers worldwide. With a highly motivated engineering team, dedicated integration support, flexible business models, strong industry presence through strategic alliances and key partnerships, Mobiveil solutions have added tremendous value to its customers in executing their product goals within budget and on time. Mobiveil is headquartered in the Silicon Valley with engineering development centers located in Milpitas, CA; Chennai and Bangalore, India; and sales offices and representatives located in US, Europe, Israel, Japan, Taiwan and Peoples Republic of China. For more information, please visit http://www.mobiveil.com.
|
Mobiveil Hot IP
Related News
- Mobiveil's PCI Express 4.0 Endpoint Controller Passes PCI-SIG Gold and Interoperability Testing
- Synopsys and ASMedia Announce Industry's First USB 3.1 Interoperability Demonstration
- Mobiveil's UNEX NVM Express IP Passes University of New Hampshire InterOperability Laboratory (UNH-IOL) Testing
- Altera's RapidIO IP Core Passes RIOLAB Device Interoperability Testing
- Altera's Triple-Speed Ethernet MegaCore Function Successfully Completes UNH-IOL Conformance Testing
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |